Image sensor based optical reader

ABSTRACT

An optical reader can include an image sensor. In one embodiment an optical reader can be configured to have different operating modes, the different operating modes optimizing the reader for reading different indicia. In another embodiment an optical reader can comprise a multiple color emitting light source. In another embodiment an optical reader can be provided in a specialized form factor including an enlarged head portion and an elongated body portion extending from the head portion.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/517,013, filed Sep. 6, 2006, (now U.S. Patent Publication No.2007/0040034) which is a divisional of U.S. patent application Ser. No.10/093,135, filed Mar. 7, 2002, entitled “Imaging Module ComprisingSupport Post For Optical Reader” (now U.S. Patent Publication No.2003/0089776) which is a continuation-in-part of U.S. patent applicationSer. No. 09/802,579, filed Mar. 8, 2001, entitled “Imaging Module forOptical Reader Comprising Refractive Diffuser,” (now U.S. Pat. No.6,601,768) which is a continuation-in-part of U.S. patent applicationSer. No. 09/411,936, filed Oct. 4, 1999, entitled “Imaging Module forOptical Reader” (now abandoned). The priorities of U.S. patentapplication Ser. Nos. 11,517,013, 10/093,135, 09/802,579 and 09/411,936are claimed and each of the above applications are incorporated in theirentireties herein by reference. The aforementioned U.S. patentapplication Ser. No. 10/093,135 filed Mar. 7, 2002 also claims priorityof the following five provisional applications: U.S. Application No.60/301,036, filed Jun. 26, 2001, entitled “Data Collection MiniatureImaging Module and Aimer Device,” U.S. Application No. 60/327,249, filedOct. 5, 2001, entitled “Multicolor Optical Reader Illumination,” U.S.Application No. 60/322,776, filed Sep. 11, 2001, entitled “DataCollection Miniature Imaging Module and Aimer Device,” U.S. ApplicationNo. 60/328,855 filed Oct. 12, 2001, entitled “Optical Reader ComprisingConductive Support Posts,” and U.S. Application No. 60/345,523, filedNov. 9, 2001, entitled “Optical Reader Module Comprising AlignmentElements.” The contents of each of the above five provisionalapplications is relied upon and incorporated herein by reference. Thebenefit of each of the above five provisional application's respectivepriority is hereby expressly claimed in accordance with 35 U.S.C.§119(e).

FIELD OF THE INVENTION

The invention relates to optical reader devices in general andparticularly to an image sensor based optical reader.

BACKGROUND OF THE PRIOR ART

Certain problems have been noted with laser based imaging modules suchas bar code reading apparatuses for optical readers. A major problemnoted with laser based bar code reading apparatuses is their lack ofdurability. Laser scan engine modules require a moving mirror which isdelicately mounted. Mirror mount structure can easily be misaligned orbroken by sudden impact of a housing incorporating the module on a rigidobject.

The mechanical complexity of a laser scanner based imaging moduleincreases significantly if the module must generate 2D image signals.There is a need for an improved image sensor based optical reader.

SUMMARY OF THE INVENTION

An optical reader can include an image sensor. In one embodiment anoptical reader can be configured to have different operating modes, thedifferent operating modes optimizing the reader for reading differentindicia. In another embodiment an optical reader can comprise a multiplecolor emitting light source. In another embodiment an optical reader canbe provided in a specialized form factor including an enlarged headportion and an elongated body portion extending from the head portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 a-1 b show front and rear perspective views of an imaging moduleaccording to the invention;

FIGS. 1 c-1 g are top, bottom, front, back, and side views of an imagingmodule according to the invention;

FIG. 1 h is a perspective assembly view of the imaging module shown inFIG. 1 a;

FIGS. 1-1L are perspective views of various component parts of theimaging module shown in FIG. 1 a; FIG. 1 m is a front view of an opticalplate of an imaging module as shown in FIG. 1 a. FIG. 1 m is a frontview of an optical plate of the imaging module as shown in FIG. 1 a;

FIG. 1 n is a cross sectional view of the optical plate shown in FIG. 1m looking in the direction indicated by lines b of FIG. 1 m;

FIG. 1 o is a perspective assembly view of an alternatively designedimaging module of the invention;

FIGS. 1 p and 1 q are partial assembly views showing alternativelydesigned component parts of an imaging module of the invention;

FIG. 1 r is an exploded view of a support post according to theinvention;

FIG. 1 s a perspective view of an embodiment of a support assembly ofthe invention;

FIG. 1 t is a perspective view of an aperture plate in accordance withone embodiment of the invention;

FIG. 1 u is a perspective view of an assembled imaging module as shownin the assembly state view of FIG. 1 o;

FIG. 1 v is a perspective view of a support assembly according to theinvention including elongated struts;

FIG. 2 a is a perspective view of an imaging module according to theinvention including surface integrated LEDs;

FIGS. 2 b-2 d are top, front, and side views of the module shown in FIG.2 a;

FIGS. 2 e, 2 f, 2 g, and 2 h show perspective views of alternativeimaging modules according to the invention;

FIGS. 2 i, 2 j, and 2 k show perspective views of imaging modulesillustrating functionality of support posts of the imaging module;

FIG. 2L is an assembly perspective view of another imaging moduleaccording to the invention;

FIGS. 2 m and 2 o are assembly state views of an imaging module of theinvention including a support assembly having a frame;

FIGS. 2 n and 2 p are front and rear perspective views of the assembledmodule shown in FIGS. 2 m and 2 o;

FIG. 3 a is a perspective view of an alternative imaging module of theinvention;

FIG. 3 b is a cutaway perspective view of the module shown in FIG. 3 a;

FIG. 3 c is a side view of the module of FIG. 3 a;

FIG. 3 d is a rear perspective view of the module of FIG. 3 a;

FIG. 3 e is a perspective view of an alternative imaging module of theinvention including a single horizontal row of LEDs and a support framesupported entirely by a printed circuit board;

FIG. 3 f is a cutaway perspective view of the module of FIG. 3 e;

FIG. 3 g is a cutaway side view of the module of FIG. 3 e;

FIG. 3 h is a top view of the module of FIG. 3 e;

FIGS. 3 i, 3 j, 3 k, 31, and 3 m are perspective views of alternativeimaging modules according to the invention;

FIGS. 4 a, 4 b, and 4 d are perspective views of an imaging moduleaccording to the invention including a flexible circuit board and lightpipes for directing light toward a target area;

FIG. 4 c is a side view of the module shown in FIG. 4 a;

FIGS. 4 e and 4 f are partial side views of an imaging module includingbendable light pipe illumination;

FIGS. 4 g, 4 h, and 4 i are perspective, front, and side cutaway viewsof an imaging module according to the invention including molded lightpipes;

FIG. 4 j is a perspective view of the module of FIG. 4 g having dashedin lines indicate structure hidden from view.

FIGS. 4 k, 4 l, 4 m, and 4 n are front perspective, rear perspective,front, and cutaway side views of a module according to the inventionincluding folded receive optics and light pipe target illumination;

FIG. 5 a is a diagram illustrating an appearance and a method forgenerating illumination pattern according to the invention;

FIGS. 5 b and 5 c illustrate molds which may be utilized in themanufacture of an optical plate according to the invention;

FIG. 5 d is an exploded perspective view of an optical plate of theinvention including cylindrical microlenses;

FIG. 5 e is an exploded partial view depicting a surface of the opticalplate shown in FIG. 5 d;

FIG. 5 f is a cross sectional exploded top view of the optical plate ofFIG. 5 d;

FIGS. 5 g-5 k illustrate top cutaway views of various optical platesaccording to the invention taken along a row of illumination lightsources;

FIG. 5L is a partial cutaway side view of an imaging module of theinvention including a solitary horizontal row of light sources;

FIGS. 6 a-6 g illustrate various views, including perspective, side, andpartial assembly views of an imaging module according to the inventionhaving aiming light sources mounted to a circuit board which carries animage sensor;

FIGS. 6 h, 6 i, and 6 j are diagrams illustrating various aiming andillumination patterns which may be projected onto a target by a moduleof the invention;

FIG. 6 k is a perspective view of an imaging module according to theinvention which incorporates aiming light sources provided by laserdiodes;

FIG. 6L is a diagram of an illumination pattern and an aiming patternwhich may be projected by the module of FIG. 6 k;

FIG. 6 m is a perspective view of an imaging module of the invention,which is well suited for carrying a 1D image sensor;

FIGS. 6 n, 6 o, and 6 p are side view functional diagrams illustratingvarious folded optic aiming systems which may be incorporated in theinvention;

FIG. 6 q is a cutaway side view of a module according to the inventionhaving a molded light pipe incorporating an aperture aiming system;

FIG. 6 r is a rear perspective view of an optical plate according to theinvention adapted for generating a split line aiming pattern;

FIG. 6 s is a top cutaway view of the optical plate of FIG. 6 r lookingin the direction of arrows A of FIG. 6 r;

FIG. 6 t is a rear perspective view of another optical plate accordingto the invention adapted for generating a split line aiming pattern;

FIG. 6 u is a top cutaway view of the optical plate of FIG. 6 t lookingin the direction of arrows A of FIG. 6 t;

FIGS. 6 v, 6 w, and 6 x are top cutaway top views of various opticalplates according to the invention taken along a line of aiming lightsources;

FIG. 6 y is a side view light ray diagram illustrating aperture effectof an aiming optical element according to the invention in oneembodiment;

FIG. 6 z is a side view light ray diagram corresponding to an aimingsystem of the invention having a thin aperture;

FIGS. 7 a-7 d illustrate an aiming pattern projected by the aimingsystem described in connection with FIG. 6 z at various module to targetdistances.

FIG. 7 e illustrates a side view of a side-leaded surface-mounted LEDwhich may be incorporated in a module according to the invention;

FIG. 8 a is a side view of a circuit board according to the inventionhaving surface integrated LEDs integrated therein;

FIG. 8 b a top view of a circuit board according to the invention havingsurface integrated LEDs integrated therein;

FIGS. 8 c, 8 d, and 8 e show side schematic use of various light pipeaiming and illumination configurations which may be incorporated in amodule of the invention;

FIGS. 8 f and 8 g are schematic views of modified light sources whichcan be incorporated in an imaging module of the invention;

FIG. 8 h is a perspective view of an imaging module of the inventionincorporating a multiple color emitting light source;

FIG. 8 i is an exploded perspective view of a multiple color emittinglight source according to the invention;

FIG. 8 j is a diagram illustrating exemplary aiming and illuminationpattern which may be projected by a module of the invention having anaiming light source and an illumination light source at differentwavelength bands;

FIG. 8 k is an optical reader, which is programmed to generate a userinteractive menu screen allowing a user to change a color emissionoutput certain of the light sources of the module;

FIG. 8L is a perspective view of a support assembly including a lensassembly retainer adapted to receive a threadless lens barrel therein;

FIG. 8 m is a top perspective view of a lens assembly lens barrelshowing a pin receiving notch thereon;

FIG. 8 n is a bottom perspective view of the barrel shown in FIG. 8 mshowing a glue receiving surface of the barrel;

FIG. 8 o is a cutaway top view of an imaging module of the inventionshowing a lens retainer and barrel detail thereof;

FIGS. 8 p and 8 q show views of a fixture which may be utilized inprecision mounting of a lens assembly within a lens retainer accordingto the invention;

FIG. 8 r is a side view of a lens retainer and lens system according tothe invention including threads;

FIGS. 8 s and 8 t are side views of an unpackaged image sensor accordingto the invention, as mounted on a printed circuit board;

FIG. 8 u is a side view of a printed circuit board having an imagesensor window in accordance with the invention whereas FIG. 8 v is aperspective view of an imaging module according to the invention havingheat sink tabs, FIG. 8 x is a side view of an imaging module of theinvention having heat sink tabs and FIG. 8 w shows a heat sink structurefor use in association with an imaging module according to theinvention;

FIG. 8 y shows a perspective view of an alternative barrel having aconcave glue receiving surface;

FIG. 8 z is a perspective view of a traditional prior art image sensorchip;

FIGS. 9 a-9 n show perspective views of various devices having animaging module according to the invention incorporated therein;

FIG. 9 o shows a side view mounting detail diagram for illustrating howa post-containing imaging module of the invention may be mounted;

FIGS. 10 a-10 e are electrical circuit diagrams associated with theinvention, depicting electrical circuitry which can at least partiallybe incorporated on a printed circuit board of an imaging moduleaccording to the invention, whereas FIG. 10 f is a software architecturediagram illustrating a software architecture which may be implemented ina device incorporating an imaging module according to the invention;

FIG. 11 is an internal side view of a prior art imaging module.

DETAILED DESCRIPTION OF THE INVENTION

In accordance with its major aspects and broadly stated, the inventionis an imaging module including a printed circuit board, an image sensorelectrically connected to the printed circuit board, a support assemblyfor supporting at least one optical element, and an illumination systemfor generating an illumination pattern onto a target. The illuminationsystem may include illumination light sources and diffusers fordiffusing light from the illumination light sources. The module mayfurther include an aiming system having an aiming light source, anaperture for stopping light from the aiming light source, and an opticalelement for projecting an aiming pattern into target area. For thereduction of the size of the module either or both of the illuminationand aiming systems may include light redirecting elements such asmirrors or prisms.

In another aspect, the imaging module may include support posts forsupporting various components of the imaging module. The module mayinclude a first circuit board carrying an image sensor, a second circuitboard carrying at least one light source, a support assembly interposedbetween the first and second circuit boards, and aligned post holes oneach of the first circuit board, second circuit board, and supportassembly for accommodating several support posts which, whenaccommodated in the post holes, support the structure including thesupport assembly interposed between two circuit boards. The supportposts may be made electrically conductive so as to avoid a need toprovide an additional electrical connector between the first and secondcircuit boards.

In another aspect, the imaging module may incorporate an aiming systemincluding a light source, an aperture and an optical element positionedoptically forward of the aperture wherein the aiming system projects acrisp and sharp aiming pattern onto a target over a wide range ofdistances. In one embodiment, an aiming system is configured so that alens aperture effect results in a crisp sharp aiming pattern over a widerange of distances including distances at which the aiming pattern isless than optimally focused. In another embodiment an aiming system isconfigured so that light emanating from a thin aperture is imaged insuch a manner that a crisp, sharp aiming pattern is defined over a widerange of distances. The aiming pattern in one embodiment includessharply defined lateral edges which are useful in sighting targetindicia.

In still another aspect, the module of the invention can include atleast one multiple color emitting light source comprising a plurality ofdifferent colored LED dies each independently drivable so that theoverall color emitted by the light source can be controlled and varied.The multiple color emitting light source can be controlled so that thecolor emitted by the light source is optimized for imaging or reading ina present application environment of the module. Further, the module canbe configured so that control of the multiple color emitting lightsource automatically varies depending on a sensed condition, such acolor present in a field of view of the module, the distance of themodule to a target, and/or a predetermined criteria being met so thatfeedback is provided to a user. The module in a further aspect caninclude illumination light sources and aiming light sources whichproject light in different wavelength emission bands.

With the substantial size reductions made possible with architecturesaccording to the invention, the positioning between a lens assembly andan image sensor can significantly affect the performance of the module.Accordingly, an imaging module in accordance with the invention may beadapted so that a position of a lens assembly can be finely adjustedrelative to a position of an image sensor. A retainer and lens assemblyaccording to the invention are complimentarily configured so that thelens assembly is slidably received in the retainer. The retainerincludes two apertures defined in sidewalls thereof. The first apertureaccommodates a fixture pin for use in finely adjusting the position ofthe lens assembly within the retainer. The second aperture accommodatesan adhesive material for adhesively bonding the lens assembly to theretainer. Adhesive material may further be applied in the firstaperture.

In a still further aspect of the invention, a module according to theinvention can include aiming and illumination light sources havingimproved architectures. Light sources incorporated in the module caninclude surface integrated LEDs in which part of the light source isdefined by a printed circuit board. Use of surface integrated LEDs in amodule appropriately configures substantially reduces a dimension of themodule in at least one plane. The module can also incorporate sideleaded surface mount LEDs which can be firmly benched against a printedcircuit board to achieve precision alignment of the LEDs withoutadditional aligning members or alignment aiding assembly steps.

In yet another aspect of the invention, a module according to theinvention can include one or more heat sink structures for reducing atemperature of the module. In another aspect, support posts of themodule are utilized for purposes other than structurally supporting andelectrically connecting members of the module. The support posts can beutilized to attach additional structural members (e.g. PCBs, opticalplates, heat sink structures) which can be considered part of the modulewhen they are attached. The support posts can also be utilized inmounting, supporting, or stabilizing the module in a housing interiormember or on another member on which the module may be attached. Themodule may further include an “unpackaged” image sensor which ismanufactured to be devoid of at least one of its traditional componentsso that a further size reduction of the module is realized. In a stillfurther aspect of the module, the module may include a flexible circuitboard so that the shape of the module can be varied, rendering themodule fittable into a variety of cavity configurations. The module canalso include light pipes for directing light from a light source into atarget area.

With the significant miniaturization achievable with modulearchitectures according to the invention, the module can readily befittable into instrument or device housings of small size which becomeoptical readers with the module installed therein. Modules according tothe invention can be installed for example in gun style reader housings,personal data assistants (PDAs), portable data terminals (PDTs), mobiletelephones, calculators, wrist watches, finger worn “ring scanners,”writing implements such as pens, and numerous other devices.

Further description of the invention is broken down into the followingeight subheadings: (A) General Imaging Module Architectures andAssembly, (B) Illumination Systems; (C) Aiming Systems, (D) IlluminationDevice Architectures; (E) Illumination/Aiming Color Emission Control andCoordination; (F) Receive Optics, (G) Packaging of Electronics; and (H)Applications, Operating Environment, and Control Circuit Functionality.It will be understood that the above subheadings are intended to providea general separation the various topics discussed in the specificationonly, and that description of certain features of the invention is inseveral instances included under more than one subheading.

A. General Module Architectures and Assembly Method

A first embodiment of an imaging module according to the invention areshown in FIGS. 1 a-1 g. Imaging module 10, 10-1 includes a first circuitboard 14 a carrying an image sensor 32 typically provided by an imagesensor chip and aiming light sources 18, and a second circuit board 14 bcarrying illumination light sources 16. The first and second circuitboards 14 a and 14 b are supported by a support assembly 80. Supportassembly 80 in module 10-1 includes a containment section 81 forcontaining image sensor 32 and an integrated retainer section 82 forretaining a lens assembly 40. Support assembly 80 of module 10-1 alongwith first circuit board 14 a and second circuit board 14 b furtherinclude post holes 83 for receiving support posts 84. Module 10-1includes four support posts 84, each of which extends through firstcircuit board 14 a, support assembly 80, and second circuit board 14 b,and thereby aids in holding of the various components of moduletogether. Imaging module 10-1 further includes optical plate 26 whichcarries various emit optical elements. Optical plate 26 of module 10-1includes illumination optics 27, 28 (see FIG. 1 n) for aiding in thedevelopment of a substantially uniform illumination pattern over atarget area corresponding to a field of view of image sensor 32, andaiming optics 25 for aiding in the projection of an aiming pattern in atarget area. Both second circuit board 14 b and optical plate includecentral apertures 836, 837 for accommodating retainer section 82 whenthey are moved toward support assembly 80. With the architecturesdescribed, substantial miniaturization of the imaging module achieved.Module 10-1 may have a width dimension of about 0.810 in., a heightdimension of about 0.450 in., and a depth dimension of about 0.560 in.Aiming and illumination light sources 16, 18 of module 10-1 are providedby surface mounted and back benched LEDs having side-extending leads or“gull wings.”

Further aspects of imaging module 10-1 are described with reference toFIGS. 1 h through 1 n. In FIG. 1 h an assembly diagram illustratingcomponents of module 10-1 in an unassembled state are described. In FIG.1 h it is seen that first circuit board 14 a carries image sensor 32provided by a image sensor chip, and a pair of aiming light sources 18provided by LEDs. Support assembly 80 of module 10-1 includescontainment section 81, which as best seen by the internal view of FIG.1 k, provides containment for image sensor 32, preventing damagethereto, and preventing stray light rays from reaching image sensor 32.Support assembly 80 further includes an integrated retainer section 82for retaining a lens assembly 40 as will be described in further detailherein. Referring to further aspects of support assembly 80, supportassembly 80 of module 10-1 includes integrated struts 80 st, havingformed therein post holes 83 as have been discussed herein, andapertures 43, for aiding in the formation of an aiming pattern as willbe described in further detail herein. Still further, shown by FIG. 1 i,support assembly 80 can include integrated mounting wings 80 w, foraiding in the mounting of imaging module 10-1 on a member external tomodule 10-1, such as a member located on an interior of a portableoptical reader housing, a PDA, a PDT, or a cellular phone, etc. Secondcircuit board 14 b and optical plate 26 each includes a central aperture836 and 837 for accommodating retainer 82. Mounting wings 80 w includescrew holes 810 for receiving mounting screws. Screw holes 810 may alsobe included in support assembly main body as are labeled in FIG. 1 h.Support assembly 80 in the embodiment of FIG. 1 i is a one piece unitcomprising a containment section 81 a retainer section 82, struts 80 st,aiming apertures 43, and mounting wings 80 w.

Referring to FIGS. 1 h, 1 j, 1 k, and 1L together it is seen that eachof printed circuit board 14 a, support assembly 80, printed circuitboard 14 b, and optical plate 26 includes a plurality of key structureswhich interlock a complementary key structure of its neighboringcomponent part or parts. In particular, first circuit board 14 aincludes a pair of key apertures 812 which receive key pins 81 h ofsupport assembly 80. Forward end 816 of support assembly 80 alsoincludes key pins 820 which are matingly received by key apertures 822of second circuit board 14 b. Second circuit board 14 b further includeslateral key apertures 826 for receiving key side pins 830 of opticalplate 26, and center key holes 834 for receiving key center pins 840 ofoptical plate 26. Key center pins 840 as best seen in FIGS. 1 j and 1 ipenetrate straight though key holes 834 of printed circuit board 146 andare received by key holes 842 of support assembly 80. The various keystructures described herein above aid in properly aligning the variouscomponent parts of module 10-1 and greatly reduce the amount of shiftingbetween component parts of module 10-1 in the XY plane after thecomponent parts are assembled. Module 10-1 further includes elementswhich aid achieving proper Z-direction spacing between component partsof module 10-1. As seen in FIG. 1 h support assembly 80 includes a pairof top and bottom integrated spacer ridges 846 for aiding in properlyspacing support assembly 80 with second printed circuit board 14 b.Aperture defining member 848 of support 80 is also raised and flattenedto aid achieving proper spacing between assembly 80 and board 14 b.Optical plate 26 also includes various spacing aiding members.Specifically, optical plate 26 includes a spacer ring 852 and a spacerridge 854. Spacer ring 852 and spacer ridge 854 are sized and configuredso that when optical plate 26 is pushed toward printed circuit board 14b, proper spacing between plate 26 and board 14 b is achieved. Proper Zdirection spacing between components of module can also be aided withuse of support post ring spacers and or steps to be described herein.Referring to further aspects of module 10-1, plate 28 includes cavities857 which receive LEDs 16. By receiving LEDs 16, cavities 857 provide afurther reduction in the depth dimension of module 10-1. While imagingmodule described herein are in most cases shown as supporting a 2D imagesensor, it will be appreciated that the architectures of the imagingmodules herein described are also useful for supporting 1D imagesensors.

One variation of imaging module 10-1 according to the invention is shownin FIG. 2 a. Like module 10-1, module 10-2 in the embodiment of FIGS. 2a-2 c includes a support assembly 80, a first circuit board 14 a, asecond circuit board 14 b, and support posts 84 for structurallysupporting the above components. However, module 10-2 does not include alens plate 26 as in module 10-1. Further, unlike module 10-1, module10-2 includes surface integrated LEDs wherein dies of LEDs are depositeddirectly onto a printed circuit board. Aiming LEDs 18 and illuminationLEDs 16 of module 10-2 shown in FIGS. 2 a-2 d are provided by surfaceintegrated LEDs. Support assembly 80 in the embodiment of FIG. 2 aincludes a barrel shaped retainer section 82 and a containment section81. Retainer section 82 retains a lens assembly 40 which may include asingle element or a multiple element imaging lens incorporated in a lensbarrel. Containment section 81 contains an image sensor 32 as will bedescribed in further detail herein. Support assembly 80 further includesstruts 80 st on which printed circuit board 14 a and circuit board 14 bmay be benched. Struts 80 st of assembly 80 as in module 10-1 may beformed integral with remaining components of assembly 80 or else struts80 st as shown my module 10-2 may be formed separate from assemblycomponents e.g. 81 and 82. Module 10-2 is shown as being devoid ofoptical plate 26 as is described herein. The functions provided by plate26 could be wholly or partially be provided by a member not incorporatedinto module 10-2 (such as a member of a reader housing 111), or else thefunctionality of optical plate 26 could wholly or partially beincorporated directly into light sources 16, 18 of module as will bedescribed herein.

Further variations of module 10 are shown in FIGS. 2 e and 2 f. In theembodiment of FIG. 2 e, imaging module 10-3 includes a single PCB 14 ainstead of first and second PCBs as shown in FIG. 1 a (module 10-1) andFIG. 2 a (module 10-2). Surface integrated aiming LEDs 18 andillumination LEDs 16 are mounted on the front side 14 f of PCB 14 whileprocessing circuitry, e.g. control circuit 140, or a part of thereof ismounted on a rear side 14 a-r of PCB 14 a. A support assembly 80including a containment section 81 and retainer section 82 for holdinglens barrel 40 in the embodiment of FIG. 2 e can have the same generalconfiguration assembly 80 shown in FIG. 2 f.

Another variation of an imaging module according to the invention isshown in FIG. 2 f. In the embodiment of module 10-4, 10 shown in FIG. 2f, support posts 84 are replaced by threaded screws 84 t which arethreaded into screw holes 83 t of PCB and support assembly 80 forsecuring of the component part of module 10. It is seen further that PCB14 b having surface integrated illumination and aiming LEDs 16, 18 canbe replaced by the combination shown of a planar member 14 p which maybe a PCB having a pair of PCBs 14 b 1 and 14 b 2 back mounted thereon,wherein each of the PCBs 14 b 1 and 14 b 2 comprise surface integratedillumination LEDs 16 and surface integrated aiming LEDs 18 as aredescribed herein. Of course, any one of the surface integrated LEDsshown and described herein can be replaced by e.g. a traditional leadedLED, a surface mount LED, a side leaded, surface mount LED, as aredescribed herein.

In the embodiment of FIG. 2 g, module, 10-5 like module 10-1 includes anoptical plate 26 mounted forward of circuit board 14 b and supported onsupport posts 84. Optical plate 26 of the type included in module 10-5of FIG. 2 g is described in more detail herein with reference to FIGS. 5d, 5 e, and 5 f. Optical plate 26 as shown in FIG. 2 g may include aplurality of substantially cylindrical microlenses and cross-connectionsas will be described in greater detail with reference to FIGS. 5 d-5 f.Optical plate 26 as shown in FIG. 2 g can also incorporate thereinaiming optics 25 provided by cylindrical lenses 25 c. As will bedescribed in greater detail, apertures 43 as shown for example in FIGS.1 h, 1 q, 1 m, 6 m and 6 q may be disposed forward of aiming LEDs 18 andlenses e.g. 25 may be configured to image light passing through anaperture onto a target area T so that an aiming line, or other aimingpattern is projected onto a target area, T. Optical plate 26 in theembodiment of FIG. 2 g can be replaced with an optical plate having aseparate diffuser 27 for each illumination LED as shown in module 10-1FIG. 1 a. As explained elsewhere herein (e.g. FIG. 1 n, FIG. 2 o, andFIGS. 5 g-5 k) optical plate 26 can have wedges 28 formed on a lightentry surface or exit surface thereof for directing light to a corner ofa target area, T.

Another variation of an imaging module is shown in FIG. 2 h by extendingposts 84 further, as shown by module 10-6, 10 of FIG. 2 h additionalmembers having incorporated post holes 83 can be incorporated intoimaging module 10. For example, the optics incorporated in optical plate26 of e.g. module 10-1 or module 10-6 can be spread out over more thanone member. As shown by module 10-6 a first optical plate 26, 860, cancarry illumination optics such as diffusers 27 and a second opticalplate 26, 862 can carry aiming optics such as cylindrical lenses 25. Aswill be explained further herein, diffusers 27 can be of any suitabletype e.g. refractive optic microlens, diffractive, or negative lens.Module 10-6, in addition to including an additional front member 862stacked on module 10, includes an additional rear member 14 p.Additional rear member 14 p may be e.g. a thermally conductiveelectrically insulating member which is employed as a heat sink for usein reducing a temperature of module 10-6, or else member 14 p may bee.g. a printed circuit board for carrying additional circuit components.

Referring to further aspects of module 10-6, posts 84 of module 10-6include ring spacers 84 r. Ring spacers 84 r may be incorporated intoposts 84, or ring spacers 84 r may comprise a plastic sleeve fittableover posts 84 or else ring spacers 84 r may comprise a member that issnap-fit into a slot machined in posts 84 p. Ring spacers 84 r aid inproperly spacing stacked members of module 10. Features of the inventionrelating primarily to support posts 84 of modules e.g. 10-1, 10-2, 10-5,and 10-6 are now described in greater detail. Formed in each strut 80 stas explained with reference to module 10-1 is a support post hole 83 foraccommodating a support post 84. In any of the post-containing modulesdescribed each support post 84 may be friction fit yet substantiallyslidable in its associated post hole 83. In the alternative, eachsupport post 84 may be rigidly mounted within associated hole 83.Support assembly 80 may be over-molded on posts 84 p to rigidly secureposts 84 p to assembly 80. Circuit boards 14 a and 14 b also have postholes 83 for accommodating support posts 84 p. Holes 14 h of circuitboards 14 a and 14 b are formed in such a manner relative to posts 84 hso that holes 14 h aid in properly aligning the various components ofmodule 10 a-1 as will be described in further detail herein. While it isseen that struts 80 st are highly useful, it is also seen that struts 80st could be eliminated in the interest of reducing the size of module10. In the embodiment of FIG. 1 v an embodiment of support 80 havingintegrated elongated struts 80 st is shown. Elongated struts 80 st maybe advantageous e.g. where struts 80 st are over molded onto posts 84and where it is desired to firmly secure posts 84 in fixed positionswithin struts 80 st.

In one method for assembling module 10 support posts 84 are inserted inthe various holes of support assembly 80 such that posts 84 extendoutwardly from assembly 80. Printed circuit boards 14 a and 14 b arethen placed over the exposed portions of post 84 p so that post holes 83of circuit boards 14 a and 14 b accommodate support posts 84. In oneembodiment of the invention post hole 83 of image sensor-carryingcircuit board 14 a can be made substantially larger than the diameter ofpost 84. Making holes 83 of circuit board 14 b substantially larger thanpost 84 allows the position of circuit board 14 a to be finely adjustedrelative to that of support assembly 80 in the X, Y, and Z directionsprior to the securing of circuit board 14 a in a certain positionrelative to assembly 80. When holes 83 are made substantially largerthan posts 84, circuit board 14 a may be tilted or moved rotationally asit is moved in a certain position relative to assembly 80 prior to thesecuring of circuit board 14 b to assembly 80. A person assemblingmodule e.g. 10-1, 10-2, 10-5, and 10-6 may utilize a video monitor toaid in the alignment process. Module 10 can be actuated to capture animage which can be displayed on a video monitor, e.g. a host computersystem (e.g. PC) video monitor as is explained more fully in U.S. patentapplication Ser. No. 09/954,081, (now U.S. Pat. No. 6,561,428) entitled“Imaging Device Having Indicia-Controlled Image Parsing Mode,” filed.Sep. 17, 2001 incorporated by reference herein. The module 10 may bemade to capture an image of a target comprising fine print indicia (e.g.a dollar bill) and a user may adjust the components of the module thatare being assembled until the displayed image displayed on the monitoris satisfactory. The securing of circuit board 14 a relative to assembly80 can be accomplished with use of solder. A further explanation of theembodiment wherein post holes 83 of circuit board 14 a are madesubstantially larger than support structures which in some limitedaspects operate similarly to posts 84 is described in copending U.S.patent application Ser. No. 09/312,479 filed May 17, 1999 entitled“Optical and Image Sensor Subassembly Alignment and Mounting Method”(now U.S. Patent Publication No. 2002/0066851) incorporated herein byreference. Where the position of image sensor 32 does not have to befinely adjusted relative to lens assembly 40, post holes 83 of circuitboard 14 a are conveniently sized to be friction-fit over posts 84.

Referring to further aspects of modules described herein including posts84, support posts 84 are preferably made electrically conductive and aredisposed in module 10 so that posts 84 provide electrical communicationbetween electrical circuit components of first circuit board 14 a andsecond circuit board 14 b. Circuit board 14 b comprises illuminationLEDs 16 and in some cases aiming LEDs 18, both requiring electricalpower for operation. Circuit board 14 a carries image sensor 32, in somecases aiming LEDs 18 and certain electrical circuitry associated withimage sensor 32 as will be described later herein. Processing circuitryassociated with image sensor 32 may be mounted on face 14 a-f and/orrear 14 a-r of circuit board 14 a. Configuring module 10 so that supportposts 84 both provide structural support and electrical communicationbetween circuit components of first and second circuit boards 14 a and14 b provide an important space conservation advantage and allows module10 to be made smaller than would be possible if separate structuralmembers (e.g. including flex connectors for connection between boards 14a and 14 b) were disposed in module 10 to provide the functions ofstructural support and electrical communication.

Further aspects of one type of support post which may be utilized withpost contacting modules e.g. 10-1, 10-7 are described with reference tothe exploded view of post 84 shown in FIG. 11 r. Support post 84 in theembodiment of FIG. 1 r comprises barb 890, a step pattern defined bysteps s1, s2, and s3 and head 892 having an open end 894 sized so thatstep s3 of another one of posts 84 can be friction-fitted or slip-fittedinto open end 894.

Barb 890 of post 84 allow post 84 to be friction-held in a certainposition in plate 26 during assembly of module e.g. 0-1 without anyoutside securing agents such as adhesive material or solder.

The step pattern of post 84 defined by steps s1, s2, and s3 eliminatesthe need to provide spacer elements on certain of the component ofmodule e.g. 10-1. Of course, steps e.g. s.sub.1, s.sub.2, and s.sub.3can be utilized in combination with spacers e.g. 878 Referring to FIG. 1o, it is seen that aperture plate 610 can be benched against ridges r12between first and second step s1 and s2. Further, it is seen withreference to FIGS. 2 i-2 k, that an additional PCB 14C or otherstructure can be benched against the ridges r23 of posts 84 definedbetween the second and third steps s2 and s3 posts 84 p.

It will be described later therein that PCB 14 b preferably compriseshighly integrated circuit components so that all, essentially all, orsubstantially all circuit components required in reader 110 are carriedby a single PCB, e.g. PCB 14 b. Nevertheless, in certain applicationswherein additional space is available, it may be desirable, for reducingthe overall cost of the circuit components, to incorporate in reader 110larger circuit components with a lesser degree of integration and tospread the circuit components over more than one major circuit componentcarrying circuit board. It will be seen that posts 84, especially whenconfigured as shown in FIG. 1 r readily facilitates moduleconfigurations wherein circuit components are spread out over severalboards and wherein the module may nevertheless retain a compactgenerally cubical configuration. As indicated previously, an additionalcircuit board 14 c may be benched against ridges r23. Furthermore theopen ends 894 of additional posts 84 a may be fitted onto posts 84 andanother additional circuit board e.g. PCB 14 d or boards may be fittedonto the additional posts. Because posts 84 can be made electricallyconductive the electrical communication between multiple circuit boardsof module 10 a can be provided by posts 84. Posts 84 therefore eliminatethe need to install space consuming electrical connectors, e.g. flexstrip receptacles, on one or more of the circuit boards e.g. 14 a, 14 b,and 14 c of module 10, when the number of conductive paths requiredbetween the boards is equal to or less than the number of the posts 84.

Further aspects of the invention relating primarily to the assembly ofmodule 10 a are described with reference to FIGS. 1 o to 1 u. FIG. 1 oshows an assembly diagram corresponding to module 10-7 which is similarto module 10-1 discussed in connection with FIGS. 1 a-1 g. In module10-7 apertures 43 are defined in nonintegrated aperture plate 610 ratherthan in support assembly 80. In one method for assembling module 10-7conductive support posts 84 are first installed in plate 26 and thenassembly 870 comprising the combination PCB 14 b having attached theretoplate 610 is applied over posts 84. Next, assembly 872 comprisingsupport assembly 80, and PCB 14 a having attached thereto LEDs 18 (shownas traditional leaded LEDs) is applied over posts 84 and posts 84 aresoldered to PCB 14 a. At interfaces 885, as best seen in FIG. 1 u, tosecure the components of module together as a packaged unit, as will beexplained in greater detail herein, solder can also be applied atinterfaces 884 between posts 84 and board 14 b to further securecomponent of module 10-7, and to provide electrical connection betweenpost 84 and board 14 b if such connection is necessary. Finally, lensassembly 40 provided by a lens barrel is inserted into retainer section82 of assembly 80, precision adjusted, and secured to retainer section82 in a manner that will be described more fully herein below. It willbe seen that the assembly process for assembling module 10-1 can besubstantially the same except that the combination of plate 26 and posts84 can be fitted onto PCB 14 b rather than the assembly comprising PCB14 b and aperture plate 610.

Referring to further aspects of module 10-7, module 10-7 like module10-1 includes a plurality of discreet diffuser patterns 27 on opticalplate 26 rather than a single diffuser pattern as is shown by module10-5 in the embodiment of FIG. 2 g. Further, it is seen that in module10-7 as in module 10-5 and module 10-1 the plane of the most forwardsurface of plate 26 is positioned forwardly of the plane defined by theexit surfaces of aimer optics 25. The positioning of optics 25 on plate26 so that the plane defined by diffusers 27 is forward of the planedefined by optics 25, protects optics 25 from damage which may be causedby incidental or accidental contact of module 10-1, 10 a-7 with variousobjects during use or installation of module 10 into a reader housing.It is useful to design plate 26-1 so that it is more likely that optics27 come in contact than optics 25 since the illumination system ofmodule 10 is less sensitive to imperfections in optics 27 than is theaiming system of module 10 to imperfections in optics 25.

Alternative module components which may be incorporated in any ofmodules e.g. modules 10-1, 10-2, 10-3, 10-4, 10-5, 10-6, and 10-7 aredescribed with reference to FIGS. 1 p and 1 q. In the partiallyassembled module of FIG. 1 p support assembly 80 comprises LED holders876. LED holders 876 hold LEDs 18 in position during the assemblyprocess so that LEDS 18 do not have to be soldered to PCB 14 a prior toPCB 14 a being attached to posts 84. That is, without LEDs 18 beingsoldered to PCB 14 a, an assembler may hold the combination of supportassembly 80, LEDs 18, and PCB 14 a together with his hand during theassembly process, place the combination of these parts over posts 84,and in one soldering step solder both of LEDs 18 to posts 84 to PCB 14 ato secure the module's component together. In a further aspect ofsupport assembly 80 shown in FIGS. 1 p and 1 s, retainer assembly 80includes spacers 878 and 880. Spacers 878 of assembly 80 provide spacingbetween support 80 and PCB 14 b. Spacers 880 (only one seen) includes anintegrated key pin for matingly engaging key hole 882 of PCB 14 b. Useof spacers 878, 880, and 846, 848 (module 10-1) to provide spacingbetween support assembly 80 and PCB 14 b rather than post holecontaining struts 80 st results in an exposed interface 884 betweenposts 84 and the rear surface 14 b-r of PCB 14 b being defined as bestseen in FIG. 1 u. Solder can be applied at these interfaces 884 duringthe assembly of module e.g. 10-1, 10-7 to reinforce the mechanicalholding forces holding together the components of module e.g. 10-1, 10-7and to reinforce the electrical contact between PCB 14 b and posts 84.In the embodiment of FIG. 1 o, aiming LEDs 18 are provided bytraditional leaded LEDs while illumination LEDs 16 are provided byside-leaded surface mounted and back benched LEDs as will be explainedmore fully hereinbelow.

FIG. 1 q shows an alternative embodiment of aperture plate 610. Apertureplate 610 shown in FIG. 1 q is a two-piece assembly comprising platesection 612 and aperture insert section 614. Plate section 612 includesa form recess 616 of a form adapted to align and receive aperturesection 614 in a desired position within module 10 so that a desiredaiming pattern is projected by module 10. Aperture section 614 isreceived in recess 616 and secured in a position therein via an adhesiveand/or friction forces. Aperture insert section 614 preferably comprisesmetal. The selection of metal as the material for use in forming section614 enables apertures 43 a, 43 b, and 43 c to be made in substantiallysmall sizes and in sizes and shapes that can be tightly controlled.Aperture plate 610 in both FIGS. 1 and 1 q includes key structures 886for engaging key structures 882 of PCB 14 b.

Reference is now made to module 10-8, shown in FIG. 2L. Aiming LEDs 18of module 10-8 have a substantially smaller height dimension than LEDs18 of module 10-9 (which are leaded LEDs). Accordingly, because it isnormally preferred to position aperture 43 as close as is physicallypossibly to aiming light source 18, aperture 43 in the embodiment ofFIG. 2L should be positioned closer to PCB 14 a than aperture 43 ofmodule 10-7. For positioning of an aiming aperture closer to the surfaceof PCB 14 a apertures 43 may be provided on support assembly 80 as isindicated in the embodiment of retainer assembly 80 shown by module 10-8in FIG. 2L and module 10-1 (FIG. 1 h). In the embodiment of FIG. 2L,shrouds 80 sh extend forwardly from apertures 43. Shrouds 80 sh may besized to the height of spacers 80 sp to reinforce the spacing functionprovided by spacers 80 sp.

Another embodiment of an imaging module according to the invention isshown in FIGS. 2 m-2 p. Like module 10-1, imaging module 10-9 isspecifically designed for use in an imaging device such as a bar codereader, an optical character recognition (OCR) reader, a reader havingboth bar code and OCR reading capabilities, personal data assistant, avideo camera, a digital camera, a cellular phone, or a medical viewinginstrument.

Unlike e.g. module 10-1 which includes support posts 84 for supportingcomponents of module 10 module 10-9 includes a mounting frame 12 whichis adapted to receive both electrical components and optical componentsof an imaging system. Mounting frame 12 is part of one piece integratedsupport assembly 80 of module 10-9 which further includes containmentsection 81 and retainer section 82. Mounting frame 12 receives a circuitboard, such as a printed circuit board (PCB) 14 a, illumination LEDs 16,aiming LEDs 18, aperture plate 610, and optical plate 26.

More specifically, frame 12 of support assembly includes a back plate 30and sidewalls including top sidewalls 31 and side sidewalls 31′. Backplate 30 includes a recessed containment section 81 for receiving asolid state image sensor chip 32 and a plurality of pin holes 36 forreceiving leads 38 of illumination and/or aiming light sources, providedby leaded LEDs 16 and 18. Support assembly 80 further includes aretainer section 82 formed integral with back plate 30 for receiving areceive optics lens assembly 40, e.g. a lens barrel, which may beinstalled in retainer section 82 prior to or after any step in theassembly process as described in greater detail below.

In assembling the module 10-9, PCB 14 a is first mounted to back plate30 using screws 56 and frame 12 is oriented so that an opening 13 isexposed. When PCB 14 a is mounted to back plate 30 the image sensor 32carried by PCB 14 a is received by center recess containment section 81which is shaped complimentary with the shape of image sensor 32 asshown. After mounting PCB 14 a to frame 12, an assembler mountsillumination LEDs 16 and aiming LEDs 18 to PCB 14 a.

To mount LEDs 16 and 18 to PCB 14 a, the leads 38 of LEDs 16 and 18 arepushed through aligned pin holes 36 and 54 of back plate 30 and PCB 14a, then the LEDs 16 and 18 are soldered to PCB 14 a. Preferably, all ofthe LEDs 16 and 18 are positioned in their respective pin holes beforesoldering. In soldering LEDs 16 and 18, the rear surface 14 a-r of PCB14 a should be oriented for easy access by an assembler. To the end thatLEDs 16 and 18 remain in a desired orientation which is substantiallynormal to PCB 14 a during soldering, a standardly known fixture (notshown) shaped to receive LEDs 16 and 18 can be temporarily applied overLEDs 16 and 18 through the soldering process.

An important feature of imaging module 10-9 is that leads 38 of theillumination LEDs 16 are installed in a nearly abutting relation tosides 32 s of image sensor 32 such that a portion of rear surfaces 19 ofLEDs 16 oppose a portion of a front surface 32 f of image sensor 32 whenthe LEDs 16 are completely installed. This arrangement reduces the sizeof the imaging module 12, enabling installation in smaller sized opticalreaders.

After LEDs 16 and 18 are mounted onto PCB 14 in the manner describedabove, the aperture plate 610 is mounted into the frame 12, the platehaving domes 42 which fit over the aiming LEDs 18. The domes arepreferably opaque to substantially block all light emanating from aimingLEDs 18, except light exiting the domes through slit apertures 43. Slitapertures 43 should be formed so that a desired shaped aiming pattern ofillumination is projected onto a target, T. In one embodiment, apertureslits 43 are shaped rectangular so that a horizontal line pattern isprojected onto a target.

Aperture plate 610 further includes a number of cutaway sections 46providing clearance to allow the aperture plate to be fitted over theillumination LEDs 16. The domes 42 and cutaway sections 46 may be formedso they do not contact LEDs 16. In the embodiment shown, each LED isheld in a desired orientation while being soldered, so that the flatsurfaces of LED bases 17 are biased against the flat surface of backplate 30 during the assembly process. In a further aspect, apertureplate 610 includes a shroud 58 for preventing light transmitted by theLEDs 16 and 18 from interfering with the receive optical systems of themodule, it is seen that shroud 58 may be configured for aiming inachieving proper spacing between back plate 30 and optical plate 26.

After aperture plate 610 is placed over LEDs 16 and 18 and moved towardback plate 30, an optical plate 26 is snap-fitted into the opening 13 ofthe frame 12. Optical plate 26 includes diffusers 27 for diffusing lightemanating from the illumination LEDs. In addition to having diffusers 27formed on a front surface thereof optical plate 26 may further havewedges 28 formed on an inner surface thereof. Wedges 28 direct lightfrom LEDs 16 toward corners of a target T so as to improve theuniformity of a target's illumination. As will be described in furtherdetail, diffusers 27 can take on a variety of forms and can be formed onlight entry surface of plate 26. Further wedges 28 can be formed on alight exit surface of plate 26.

Resilient fingers 48 having hook ends 49 are formed in the top or sidesidewalls 31 of frame 12 to enable snap-fitting of the optical plate 26onto frame 12. In the embodiment shown, the optical plate 26 may besnap-fitted onto the frame 12 by pulling back the resilient fingers 48,pushing the optical plate toward the back plate 30, then releasing thefingers 48 to lock plate 26 in position inside module 10. The plate andfingers may be formed so that the fingers are spread apart and releasedby plate 26 when optical plate 26 is pushed toward back plate 30. Fullyassembled, module 10-9 may have a height dimension of about 19 mm 0.75inches), a width dimension of about 39 mm (1.5 inches), and a depthdimension of about 27 mm (1.06 inches).

To the end that essentially the entirety of the required electroniccircuitry of an optical reader can be packaged into a single printedcircuit board, the back surface of the frame's back plate 30 may beconfigured to accommodate electrical components that will extend forwardfrom the front surface 14 a-f of PCB 14 a. Accordingly, it is seen thatthe rear surface of back plate 30 includes a central recess 34 foraligning and receiving solid state image sensor 32 and peripheralrecesses 35 for accommodating electrical circuitry 802 such ascomponents and/or conductors which may protrude from the front surfaceof PCB 14 a. The aperture plate 610 includes spacers 52 which operate tobias aperture plate 24 toward back plate 30 when optical plate 26 issnap fitted onto frame 12. The spacers 52 of module 10-9 furthertransfer the force imparted by fingers 48 on optical plate 26 to theaperture plate 610, securing both the aperture plate 610 and opticalplate 26 inside frame 12 without the use of adhesives or outsidemechanical securing means, such as screws or pins. In the embodiment ofFIG. 2 n optical plate 26 includes a separate diffuser 27 for eachillumination LED 16. In the alternative embodiment of FIG. 5 d a singlediffuser 27 is formed substantially throughout the surface of plate 26.

Referring to further variations of module 10, in the embodiment of FIGS.3 a-3 d imaging module 10-10 includes a printed circuit board 14 ahaving both an image sensor 32 and illumination LEDs 16 mounted thereon.A pair of LEDs are mounted on either side of image sensor 32 to form apattern of LEDs comprising four substantially linearly arranged LEDs.Mounting of LEDs in a horizontally oriented linear pattern reduces theheight dimension requirements of module 10-10 relative to that of module10-9 and module 10-1. Mounting of LEDS in a horizontally oriented linearpattern allows the height of module 10-2 to be reduced to a heightcloser to the height of image sensor 32. Referring to further aspects ofmodule 10-10, module 10-10 includes a support assembly 80 mounted to andextending from PCB 14. Support assembly 80 in each of the embodimentsshown of FIGS. 3 a-4 d and 4 k-4 n includes a containment section 81 anda retainer section 82. Containment section 81 contains image sensor 32while retainer section 82 retains lens assembly 40. Retainer 82 alsoprevents light rays not corresponding to the image at a target, notablyrays emanating directly from LEDs 16 from reaching image sensor 32.

Referring to further variations of an imaging module according to theinvention, in the embodiment of FIGS. 3 e-3 h imaging module 10-11includes a printed circuit board 14 a having mounted thereon an imagesensor chip 32, illumination LEDs 16, and aiming LEDs 18. Three LEDs aremounted on either side of module 10-11 to form a horizontally orientedsubstantially linear pattern of LEDs comprising six LEDs. Inner LEDs 18are aiming LEDs while outer LEDs 16 are illumination LEDs. IlluminationLEDs 16 may be canted (mounted at angles) as best seen in FIG. 3 h sothat a center of a target area is more uniformly illuminated absentadditional illumination optics.

Further variations of imaging modules are shown in FIGS. 3 i-3 m. Inmodule 10-12 of FIG. 3 i the configuration of support assembly 80 ismodified so that assembly 80 is box shaped and of substantially uniformheight, width and depth. Box-shaped containment and retainer assembly80, particularly when sized to a height substantially equally to that ofcircuit board 14 provides certain packaging advantages. For example, ifmodule 10-12 is mounted in an instrument housing so that assembly 80abuts on a planar surface of an instrument housing, box shaped assembly80 aids in the stabilization of module 10-12. Module 10-13 shown in FIG.3 j comprises a configuration essentially identical to module 10-12except that the leaded LEDs are replaced with surface mounted LEDs 16and 18 as shown. It is understood that the leaded LEDs described hereincan normally be replaced with surface mounted LEDs as seen in FIG. 3 j,side-leaded surface mounted LED, or surface integrated LEDs.

Modules 10-10, 10-11, 10-12 and 10-13 may be used in combination withillumination optics mounted to a separate member of an instrumenthousing 111. Alternatively, illumination optics can be incorporated intothe module as illustrated by modules 10-14, 10-15 and 10-16 of FIGS. 3k, 3L, and 3 m. Module 10-14 of FIG. 3 k includes form fit diffusers504, 27 which are adapted to be friction-fit over illumination LEDs 16.In the embodiments shown in FIGS. 3L and 3 m module 10-15, 10-16includes optical flanges 803 extending outwardly from assembly 80. Eachflange 803 may include slit aperture 43 for shaping light from aimingLEDs 18 and a diffuser 27 for diffusing light from illumination LEDs 16.Diffusers 27 may be molded into flanges 803 as part of plate inserts560. Flanges 803 may be formed integral with support assembly 80 using amold adapted for manufacture of a one piece containment, retainer andflange assembly. Flanges 84 may also be mounted to PCB 14 a or to amember of the instrument housing in which the module is installed.Module 10-16 shown in FIG. 3 m is similar to module 10-15 except thatleaded LEDs are replaced with surface mounted LEDs 16 and 18 as shown.In addition, flanges 803 of module 10-16 are spaced apart at a closerdistance to PCB 14 a than flanges 803 of module 10-15.

Diffusers 27 of module 10-15 are shown as being of the type includinghorizontally oriented substantially cylindrical microlenses formed on alight exit surface of the optical member including diffusers 27. As willbe described in greater detail herein, substantially cylindricalmicrolenses operate to diffuse light preferentially transversely to theorientation of the microlenses. Thus horizontally oriented microlensesof diffusers 27 of module 10-15, having linearly arranged illuminationLEDs 16 will operate to increase the height dimension of the overallillumination pattern generated using a linearly arranged set of lightsources.

Another imaging module is shown in FIGS. 4 a-4 d. In module 10-17, aflexible printed circuit board 14 a carries an image sensor chip 32 anda light pipe 310 for transmitting light from a source location 312 to alight pipe distal end 314 remote from the source location. Light pipe310 of module 10-17 is shown as being provided by a fiber optic cable.However, light pipes may also be molded light pipes. Fiber optic cablesare available from several manufacturers including Schott Corp. ofWayzata, Minn. and Bivaropto, Inc. of Irvine, Calif. Light pipes 310 canbe any length and can be mounted at substantially any location offlexible circuit board 14 a of module 10-17. It will be appreciated thatthe configuration of module 10-17 allows installation of module 10-17into a wide variety of instrument housings and equipment. Flexiblecircuit board 14 a of module 10-17 which may be a type available fromMinco, Inc. of Minneapolis, Minn., may be bended into a virtuallylimitless number of forms to allow installation of module 10-17 intoinstrument housings of a wide variety of shapes and sizes. Furthermore,light pipe 310 provides illumination of a target area T when distal ends314 are directed to a target without requiring that space consuming LEDsbe mounted in a certain arrangement about an imaging axis. An importantadvantage of incorporating light pipe 310 into an imaging module 10-17is that the radiance of illumination emitted by an individual light pipecan be increased without increasing the space consumed by the distal end314 of the individual light pipe. The radiance of light emitted at adistal end 314 of a light pipe can be increased by directing light frommore than one source into a source end 312 of the light pipe. A sourceend of a light pipe can be split into two or more light entry units 312a and 312 b as shown by FIG. 4 e, each of which is disposed in proximitywith a light source such as an LED. Also, a light pipe can be made tohave a large source end and diameter enabling it to receive light frommore than one light source as shown by FIGS. 4 f, 4 i and 4 j.

Now referring to FIGS. 4 g-4 j an imaging module 10-18 is describedhaving molded light pipes 311. In module 10-18, PCB 14 a is arrangedparallel to imaging axis, a.sub_(i), and image sensor chip 32 is mountedperpendicularly on PCB 14 a. Image sensor 32 may be perpendicularlymounted on PCB 14 a by using a rigid flex PCB. Referring to furtheraspects of module 10-18, LEDs 16, and 18 provided by surface mount typeLEDs are mounted on PCB 14 a and molded light pipes are disposed inrelation to LEDs 16 s and 18 s so that light from LEDs 16 and 18 isdirected through distal ends 314 of light pipes in a direction generallyparallel to imaging axis, a.su._(i), toward a target T. Molded lightpipes 311 are available from such manufacturers as Bivaropto, Inc. ofIrvine Calif. and Dialight Corp. of Manasquan, N.J. Diffusers can bemolded onto the distal ends of illumination light pipes 311, 311 i as isindicated by diffusers 27 shown in FIG. 4 g. Diffusers can be e.g.diffractive optic, refractive optic (e.g. microlens), or negative lensdiffusers. Diffusers can also be formed at distal ends 314 of pipes 310of module 10-17. As in the case of a fiber optic cable light pipe, theradiance of illumination emitted by any one molded light pipe 311 can beincreased by widening source end 312 of pipe 311 and disposing sourceend 311 to collect light from more than one light source, as isindicated by light pipes 311 i of FIG. 4 g. Illumination light pipe 311i of module 10-18 shown in FIG. 4 j collects light from three surfacemounted LEDs 16 whereas aiming light pipe 311 a collects light from asingle surface mount LED 18.

Arranging PCB 14 a parallel to imaging axis, a.sub_(i), and installingmolded light pipe 311 on PCB 14 a to direct light in a directionparallel to PCB 14 a reduces the height dimension of module 10 andfacilitates installation of the module to in a “thin” instrument housinghaving a small height dimension. The height dimension of an imagingmodule 10 having light pipe illumination can be reduced further by backmounting of image sensor chip 32 on PCB 14 a as is illustrated by module10-19 shown in FIGS. 4 k-4 n. In the embodiment of FIGS. 4 k-4 n imagesensor chip 32 is back mounted on PCB 14 a together with a containmentand retainer assembly 80 that is equipped with folding optics sufficientto fold imaging axis, a.sub_(i), substantially 90 degrees. Foldingoptics can be provided, for example, by formation of plated reflectivematerial on or by affixing a mirror to wall 402 as indicated bydashed-in mirror 404. Because module 10-19 can be designed to have aheight dimension smaller than the width of image sensor 32, module 10-19is especially well-suited for installation in “thin” reader housings.For example, module 10-14 is well suited for installation into thehousings of a personal data assistant “PDA” such as a cellular phone asshown in FIG. 9 i, or a hand-held computer as shown in FIG. 9 j.

B. Illumination

Features of illumination systems in accordance with the invention arenow described primarily with reference to FIGS. 5 a-5 f. Forsubstantially uniform illumination of a target area T in an overallpattern 520 corresponding to the field of view of image sensor 32 (inwhich corners are illuminated to a brightness of at least about 50% ofthe target areas maximum brightness), light emanating from each LED in atwo row, four LED illumination system (as in e.g. module 10-1 or module10-9) should be diffused to provide a substantially rectangularillumination pattern having borders 19 substantially defined by lines522 as is shown in FIG. 5 a.

Shown in FIG. 5 b is a surface of a mold 526 for use in manufacturing amultiple diffuser optical plate 26 e.g. of module 10-9 (FIG. 2 n), mold526 may have installed therein separately manufactured diffractive moldelements 528. Mold element 528 installed in mold 526 may be of the typemanufactured using holographic techniques as are available from PhysicalOptics Corp. of Torrance, Calif. and Fresnel Optics of Rochester, N.Y.Other manufactures of diffuser optical elements include DOC ofCharlotte, N.C., MEMS of Huntsville, Ala. and RPC of Rochester, N.Y.

Shown in FIG. 5 c is a surface of a mold 527 for use in manufacturing asingle diffuser optical plate 26 as is incorporated in e.g. module 10-5of FIG. 2 g and as shown by plate 26 of FIG. 5 d. Mold 527 includes atexture formed directly thereon. The texture may be applied by way of anacid resist process. Mold texturing companies, such as Mold Tech, Inc.of Painsville, Ohio specialize in applying textures to molds by way ofan acid resist process as in old 527 used to make a part having asurface having the texture shown in FIG. 5 e. A suitable material foruse in the manufacture of optical plate 26 in any of the embodimentsdescribed herein is polycarbonate.

The textured surface mold 527 of FIG. 2 p is generally less expensiveand more durable than the mold having installed diffractive diffusermold element inserts 528 of FIG. 5 b. Diffractive mold element 528 iscostly to manufacture, and requires frequent replacement. Textured moldsas shown in FIG. 5 c are typically used in applications such asmanufacturing fingerprint-resistant surfaces. As far as is known, lighttransmissive plates made using insertless textured surface molds asshown in FIG. 5 c have been incorporated in products having lightsources primarily for the purpose of obscuring the view of a lightsource, and have not been used to produce controlled target areaillumination of an image capture system.

Exploded views of the diffuser surface of optical plate 26 of FIG. 5 dhaving a single diffuser 27 for diffusing light from several LEDs areshown in FIGS. 5 e and 5 f. Plate 26 comprises a plurality ofsubstantially adjacent and substantially cylindrical microlenses 550.Referring to further aspects of microlenses 550, microlenses 550 arepreferably formed in randomized pattern on plate 26 characterized inthat microlenses 550 comprise at least two different sizes without aparticular ordering of similar-sized microlenses and without preciseparallel relative orientation between the lenses. Randomization of thepattern reduces the formation of “hot spots,” concentrated areas ofconstant higher radiance illumination, on a target area T. In anotheraspect of plate 26, plate 26 as shown in FIG. 5 d preferably comprisesoccasional cross-connections 552 defined in the valleys 554 delimitingthe various cylindrical microlenses 550. Cross-connections 552 providediffusion of light in a direction generally transverse to the directionof light diffusion provided by microlenses 550 microlenses 550 arebelieved to operate by converging light rays from sources 16 intoconvergence points positioned closely forward of lenses 550, such thatthe rays are in diverging relation to another at typical module totarget reading distances (e.g. about 1 inch to 15 inches for commoncodes).

Referring to FIG. 2 q, the diffused light pattern generated by a singlelight source as diffused by single diffuser optical plate 26 shown byFIG. 5 d is designated as the pattern substantially determined by borderlines 522 of the overall illumination pattern substantially delimited byborder 520. Vertically oriented cylindrical microlenses 550 tend todiffuse light in a horizontal direction while the lensing provided bycross-connections 552 tend to diffuse light from a light source in avertical direction. It can be seen that diffusion patterns can becontrolled by appropriate shaping of microlenses 550. Reducing theincidence of cross-connections 552 would reduce the diffusion of lightin the vertical direction. With a reduced incidence of cross connectionsan illumination pattern corresponding to a single light sourcesubstantially delimited by dashed line 521 may be generated. Increasingthe incidence of cross-connections 552 would increase the diffusion oflight in the vertical direction. An increased incidence of crossconnections 552 might generate the illumination pattern for a singlelight source delimited substantially by dashed lines 523. A diffusercomprising a series of spherical refractive optic microlenses would beexpected to generate a substantially uniform circular illuminationpattern which may be highly desirable depending on the intendedapplications and overall design of the module. Diffusing light in avertical direction to increase the height of an illumination pattern isparticularly useful in the case that a target illumination diffuser isincorporated in an imaging module having a single row of horizontallyoriented light sources and incorporates a 2D image sensor. Referringagain to FIG. 3L, module 10-15 comprises plate inserts 560 includingdiffusers 27 comprising horizontally oriented cylindrical microlenses550. Microlenses 550 of module 10-15 diffuse light vertically withrespect to the horizontal axes h of module 10-15 thereby increasing thevertical (height) dimension of the illumination pattern projected bymodules 10-15. Microlenses 550 of plate 26 or plate inserts 560 may notbe formed in a randomized pattern and may not comprise cross-connections552. Nevertheless, cylindrical microlenses 550 of plate 26 describedwith reference to FIG. 5 e operate to diffuse light in a directiongenerally perpendicular to microlenses 550. Plate insert 550 of module10-15 could be replaced with a plate similar to plate 26 of FIG. 5 dhaving randomized pattern of microlenses and being modified to includecylindrical microlenses oriented horizontally rather than vertically.Optical plate 26 e.g. plate 26 of FIG. formed with use of substantiallyuniformly textured mold 527, diffuses light substantially via refractiveoptics. By contrast, optical plate 26 shown e.g. in module 10-9 madeusing a mold e.g. mold 526 having holographic formed inserts diffuseslight substantially via diffractive optics. Configuring optical plate 26to diffuse light substantially via refractive optics as opposed tosubstantially via diffractive optics is advantageous at least for thereason that molds used to make refractive optic diffusers are easier tomake and less expensive, while being substantially more durable thanmolds used to make diffractive optic diffusers. As is known by skilledartisans, diffractive optical characteristics predominate when opticalelements transmitting light are in a range of sizes proximate thewavelength of light being transmitted. Several imaging modules describedherein include light sources that emit light in the wavelength range offrom about 0.4 to about 1.0 microns. For refractive diffusing of lightin this wavelength range the optical elements of a diffuser should havedimensions substantially larger than the upper limit of this range, e.g.at least about 10 microns. For example, as best seen in cross sectionalview of FIG. 5 f, cylindrical microlenses 550 of optical plate 26 ofFIGS. 5 d, 5 e, and e.g. modules 10-5 and 10-9 may have an apex-to-apexseparation that ranges from about 0.018 inches to about 0.028 inches.

Referring to further aspects of optical plate 26, it will be understoodthat optical plate 26 can be made using a mold having diffuser sectionmold inserts similar to inserts 528, wherein the inserts include amicrolens-forming texture as in mold 57. Providing a mold similar tomold 526 except having microlens forming mold inserts instead ofdiffractive diffuser mold inserts 528 facilitates the cost advantages ofutilizing mold 527 and other advantages. New mold inserts can beinterchanged into the mold to replace a worn mold insert or to satisfy aspecial customer request for example. Mold inserts can be manufacturedin accordance with the texturing process as described in connection withFIG. 5 c or else mold inserts can be machined from metal members using astandard metal machining process. As indicated previously microlensesmade from a mold can be cylindrical or spherical, can include or besubstantially devoid of coarse connections 552 and can have uniform ornonuniform apex to apex distances. Modules 10-1, 10-7, 10-8 are examplesof modules including optical plates 26 manufactured using a moldcomprising a plurality of microlens-forming mold inserts.

In addition to having at least one diffuser 27, optical plates 26described herein for use with modules e.g. module 10-1 and module 10-9include wedges 28 formed on light entry surfaced thereof as shown byFIG. 1 n (relating to module 10-1) and FIG. 2 o (relating to module10-9). Wedges 28 operate to direct light from illumination light sources16 toward corners of a target area e.g. target area 520 as shown in FIG.5 a.

Diffusers 27 as shown in the various imaging modules can be provided ina number of varieties. Examples of optical plates 26 have varying typesof diffusers are described with reference to FIGS. 5 g through 5 kshowing a top view of optical plate 26 in various embodiments taken along a row of illumination LEDs 16. In the embodiment of FIG. 5 goptical plate 26 includes diffractive optic diffusers 27, 27 a as showne.g. by module 10-9. In the embodiment of FIG. 5 h, optical plate 26includes refractive optic microlens diffusers 27, 27 b as shown e.g. bymodule 10-1. In the embodiment of FIG. 5 i, optical plate 26 comprisesnegative lens diffusers 27, 27 c. Negative lens diffusers are providedby forming negative lens (generally concave) lens surfaces on plate 26.With use of a negative lens to provide a diffusion function, light raysgenerated by sources 16 are in diverging relation to one another whenexiting light exit surface 566 plate 26. Negative lens diffuser 27 c asseen from a top view in FIGS. 5 i, 5 j, and 5 k can be a sphericalnegative lens or a vertically oriented cylindrical lens. If negativelens diffuser 27 c is a vertically oriented cylindrical lens, diffuser27 will tend to diffuse light horizontally. If negative lens 27 c isspherical it will tend to diffuse light both vertically andhorizontally. It may also be desirable to include in one of the modules10 described herein a horizontally disposed cylindrical negative lensdiffuser 27 c which diffuses light vertically. FIG. 5L shows afunctional partial side view a modified version of module 10-15 (FIG.3L) including a single row of LEDs and flanges 803, which hold opticalplate inserts 560 at positions forward of LEDs. In the variation ofmodule 10-15 shown in FIG. 5L it is seen that refractive optic microlensdiffusers 27 of module 10-15 can comprise horizontally orientedcylindrical negative lens diffusers 27 c for diffusing light vertically.While negative lens surfaces 27 c are shown as being provided on boththe light entry and light exit sides of plate 560 it is understood thatnegative lens surfaces could be provided on just one of the light entryand light exit surfaces shown in FIG. 5L.

Referring again to the variations of optical plates 26 shown in FIGS. 5g through 5 k, FIG. 5 i illustrates that diffusers 27 need not be formedon a light exit surface of plate 26. Plate 26 of FIG. 5 i furtherdemonstrates that a surface of plate 26 can comprise a combination ofoptical elements. In plate 26 of FIG. 5 i, surface 567 comprises anegative lens diffuser surface 27 c superimposed on a wedge 28 lightentry surface. Surface 568 of plate 26 shown in FIG. 5 i comprises amicrolens diffuser surface 27 b superimposed on a wedge 28. Opticalplate 26 of FIG. 5 i further comprises a wedge 28 formed on a light exitsurface of optical plate. Referring to optical plate 26 of FIG. 5 k, theembodiment of FIG. 5 k demonstrates that diffusers 27 can be formed onboth of light entry and light exit surfaces of plate 26. Optical plate26 of FIG. 5 k includes a negative lens diffuser surfaces 27 c formed onboth of light exit 566 and light entry surfaces 565 of plate 26.Negative lenses 27 c shown in FIG. 5 k can be cylindrical or sphericalnegative lens. In one embodiment, all negative lenses 27 c of FIG. 5 kare spherical. In another embodiment they are all cylindrical. In yetanother embodiment negative lenses 27 c on light exit surface 566 ofplate 26 are vertically oriented cylindrical negative lenses and lenses27 c on light entry surface 565 of plate 26 are spherical negativelenses. In another embodiment spherical negative lenses are disposed onlight exit surface 566 of plate 26 and cylindrical negative lenses 27 care disposed on light entry surface 565. Any one of plates 26 describedwith reference to FIGS. 5 g-5 k can be incorporated in any one ofmodules 10 described herein including an optical plate 26. Furtherdiffusers 27 of e.g. module 10-14, 10-19 can be of any of the varietiesdescribed.

C. Aiming Systems

An aiming pattern generating system is described herein wherein anaiming optics element 25 is disposed forward of an aiming aperture 43 toimage light rays emanating from the aiming aperture. Several variationsof aiming pattern generating systems according to the invention are nowdescribed.

For providing an aiming pattern that is clear and sharp it is normallypreferred that a substantial distance is provided between optics 25 andaiming aperture 43. For example, if aiming optics 25 includes imagingoptics, slit 43 should be disposed behind a back focal point of optics25. In module 10, 10-20 (FIG. 6 a) and module 10-1 (FIG. 1 a) asubstantial distance between aperture 43 and optics 25 is provided bymounting aiming LEDs 18 on circuit board 14 a rather than on circuitboard 14 b. Aiming LEDs 18 of module 10-20, shown as being provided bytraditional leaded LEDs, are conveniently mounted on circuit board 14 ain a position such that they are located horizontally laterally relativeto retainer section 82 of support 80.

Further, with reference to module 10-20, aiming apertures 43 aredisposed in a cluster formation by way of aperture 43 a, 43 b, and 43 cso that a two-dimensional image is projected onto target T by thecombination of aiming LED, aperture cluster comprising apertures 43 a,43 b, 43 c, and optics 25. With reference to optics 25, it is seen thataiming optics 25 of module 10-20 comprises spherical lens 25 s ratherthan a cylindrical lens. Apertures 43 of module 10-20, like apertures 43of e.g. module 10-1, 10-7, 10-8, 10-9, 10-15, 10-16, and 10-22 areformed in abutting or nearly abutting relation relative to light source18. Apertures 43 a, 43 b, and 43 c are therefore imaged in thehorizontal and vertical directions onto a target T by optics 25.Aperture cluster comprising apertures 43 a, 43 b, and 43 c can belaterally offset relative to lens 25 s, so that the pattern imaged bylens 25 s moves laterally inward toward a center of a target T as module10-20 is moved closer to a Target, T. It is seen that providingsymmetrical aiming pattern generating subsystems on either side ofmodule, wherein there is lateral offset between aperture clusters 43 a,43 b, and 43 c and lenses 25 s results in the pair of patterns projectedby the pair of illuminations systems converging at a certainmodule-to-target distance. The aiming pattern generating system can bedesigned so that the pair of aiming patterns converge at the best focusposition of module 10. With reference to further aspect of module 10-20,module 10-20 like module 10-7 includes aperture plate 610. Apertureplate 610 is disposed on PCB 14 b. Plate 610 includes lead holes 620 foraccommodating leads of illumination LEDs 16 and apertures 43, asdiscussed previously. Plate 610 should be opaque at least in the area ofapertures 43 a, 43 b, and 43 c. In the variation of plate 610 shown inFIG. 6 d, plate 610 includes a metal aperture insert 614 for precisiondefining of small-sized apertures. Module 10-20 further includes arefractive optic diffuser plate 26 comprising substantially cylindricalmicrolenses as described previously in connection with FIG. 5 e. Module10-20 further evidenced that support posts 84 are advantageous for thepurposes of accommodating a stacked-up configuration for module 10 whichincludes a plurality of plate-like members such as PCB 14 a, PCB 14 b,plate 610 and optical plate 26. Refer now to aspects of module 10-20spherical lens aiming optics 25 s could be replaced with cylindricallenses 25 c or other optical elements for imaging apertures 43 onto atarget area T.

Representations of other exemplary illumination and aiming illuminationpatterns which may be projected by the illumination system of modules 10described herein are shown in FIGS. 6 h-6 j. In FIG. 6 h, area delimitedby border 520 represents the region relative to a target area Tilluminated by illumination LEDs 16 while area 630 represents the regionof the target area highlighted by aiming LEDs 18 and their associatedoptics. In the embodiment of FIG. 6 h aiming LEDs 18 and theirassociated optics (43, 25) project a solitary horizontal aiming line 630onto a target area T.

The straight line aiming pattern of FIG. 6 h, in one embodiment may begenerated by manufacturing plate 26 so that horizontally orientedcylindrical lenses 25, 25 c are formed on the outer surface of opticalplate 26 as is shown in module 10-9 of FIG. 2 n. Horizontally orientedcylindrical lenses 25, 25 c are configured so that when plate 26 isapplied over LEDs 18 lenses 25 are aligned coextensively and forwardlyrelative to slit apertures 43 in order to image light slit apertures 43onto a target T, defined by a module's field of view. Cylindrical lenses25 may have a thickness of about 3 mm and a radius of curvature of about4.5 mm, convex. While lenses 25 are preferably of a type which convergeand thereby image light rays passing through aperture 43, it will beseen that an acceptable aiming pattern may also be projected with use ofoptics which substantially collimate light rays passing through aperture43 or which include other elements which operate to define a crisp sharppattern as will be described herein. A straight line aiming patternillustrated by line 630 or FIG. 6 h can also be generated with sphericallenses 25 s and slit aperture 43 as shown in module 10-1. Methods forprojecting crisp, well-defined aiming lines over large reading distanceswill be described herein.

In modules e.g. 10-1, 10-9 and in the illumination system described incopending U.S. patent application Ser. No. 09/658,811, filed. Sep. 11,2000, entitled “Optical Assembly for Barcode Scanner” (now U.S. Pat. No.6,607,128) and incorporated herein by reference (module 10-22), aimingLEDs 18 project unfolded light rays into a target area and are orientedin a direction that is substantially parallel to the imaging axisa.sub_(i) of module 10-1 at the light entry 1 e position of module 10-1(the imaging axis a.sub.1 of modules e.g. 10-1, 10-9, and 10-22 isunidirectional). In module 10-22, lens 25 images a slit aperture 43 intobar code space, there being provided two LEDs 18 per aperture 43.

However, as is indicated by modules 10-17, 10-18 and 10-19 light rays ofaiming LEDs 18 and illumination LEDs 16 can be folded (imaging axisa.sub.1 of module 10-19 of FIG. 4 n is folded and has differentdirections at the light entry 1 _(e) and light receive 1 _(r) positionsof module 10-19). FIGS. 6 n, 6 o, and 6 p show alternative types ofaiming pattern generating systems that may be incorporated in an imagingmodule in which light generated by an aiming LED such as LED 18 isfolded. In the embodiment of FIG. 6 n aperture 43 which may be imaged bylens 25 onto a target T is positioned forward of light reflectiveelement 640 in the optical path. This embodiment is useful where lightpipes are used in combination with aiming LEDs to prevent divergence ofthe aiming illumination light rays. In the embodiment of FIG. 6 oaperture 43 which may be imaged by lens 25 onto a target T is positionedforward of LED 18 and optically rearward of light reflective element 640in the optical path. The embodiment of FIG. 6 p includes an aperture 43positioned between light source 18 and light reflective element 43 r andan optical element 25 p including a prism for imaging light fromaperture 43 onto a target and for redirecting aiming illumination lightreflected from reflecting element 643. Optical element 25 p includes aprism defined on a light entry surface thereof and an imaging lenssurface (spherical or cylindrical) on a light exit surface. It is seenthat the embodiment of FIG. 6 p including a light redirecting prism 25p, can be utilized for reducing the height requirements of an imagingdevice in which the system is installed. Folded optic aperture aimingsystems are readily incorporated into aiming optical light pipes asshown by FIG. 6 q. In FIG. 6 q, light pipe 311 transmits light fromaiming light source. Incorporated into light pipe 311 is an aperturestop 641 defining an aperture 43. Disposed at distal end 314 of lightpipe 311 is an aiming optic 25 for imaging aperture 43 into targetspace.

Referring to other aiming patterns which may be projected by modules ofthe invention, a split line aiming pattern is shown in FIGS. 6 i and 6j. The split horizontal line aiming pattern shown in FIG. 6 i may beformed by providing, as shown in FIG. 6 s, aiming pattern wedges 29 onthe light entry surface of optical plate 26 opposite aiming patterncylindrical lenses 25. Aiming pattern wedges 29 operate to direct lightfrom aperture slits 43 outwardly toward the sides of a target area T sothat a gap 650 between two horizontal line segments 648 is defined inthe center of a module's field of view when the module is within a rangeof distances from a target at which it can capture image data ofacceptable quality at (the best focus distance of the module is withinthis range). The split line aiming pattern comprising segments 648allows a user to easily align the center of the module's field of viewwith a center of a region of interest.

It may be desirable to restrict the width of a split horizontal lineaiming pattern 647 comprising segments 648 so that line segments 648 donot extend substantially beyond a reader's target area T as defined by areader's field of view. In order to restrict the width of splithorizontal line aiming pattern comprising segments 648, verticallyoriented cylindrical lenses may be superimposed on aiming pattern wedges29 as is illustrated in FIG. 2 j to form combined wedge and verticallyoriented cylindrical lens elements 29′. Aligning combined wedge and lenselements 29′ with slit aperture 43 provides an aiming pattern having thefeatures shown in FIG. 6 j, wherein split horizontal line aiming patterncomprising segments 648 is contained substantially within a target areaT defined by a reader's field of view.

When positioned relative to apertures 43 as shown in the particularembodiment of module 10-9, cylindrical lenses 25 of optical plate 26operate to converge and thereby image light from aperture slits 43. Inthe modules described shown having aiming optics 25 sharpness of aimingpattern 630 preferably will not vary substantially as the distance ofmodule 10 to a target is varied. Optics 25 may be adapted to converge(and thereafter diverge) light gradually. Because optics 25 can beadapted to gradually converge light rays optics 25 could be described asproviding the function of substantially collimating light. Further,optics 25 can actually collimate or even diverge light rays exitingoptics 25 provided an aiming system includes features resulting in asharp aiming pattern being projected on target, T. Optics 25 may includemultiple features which result in pattern e.g. 630 appearing sharp overvarious module-to-target distances.

In one variation of the invention, aiming illumination optics areprovided so that the sharpness of aiming lines e.g. lines 648 variesdepending on the module to target distance. More specifically, aimingillumination optics may be provided so that aiming lines e.g. 648 aresubstantially most sharp at the best focus position of module 10 andless sharp when a reader equipped with module 10 is moved away from thebest focus position.

Referring to further aspects of the invention it will be understood thatin any of the modules described herein, aiming light sources 18 could beprovided by laser diode assemblies. When aiming light sources 18 areprovided by laser diode assemblies of the type incorporating a built-incollimating lens it may be considered unnecessary to include elementssuch as aperture 43, or optics 25 since such laser diode assembliesinherently produce a crisp aiming pattern over a wide range of module(reader) to target distances. An aiming pattern generated by a laserdiode assembly aiming light source 18 may be a spot of light in targetarea, T. Module 10-21 of FIG. 6 k includes illumination light sources 16provided by surface integrated LEDs and aiming light sources 18 providedby laser diode assemblies. Imaging module 10-21 may project an aimingpattern as shown by FIG. 6L. Laser diode assembly aimers 18 may projecttwo dots 637, 638 onto target, T. If diode assemblies 18 are canted,imaging module 10-21 can be adapted so that dots 637, 638 converge at abest focus distance.

In another useful embodiment of the invention, emit optics comprisingoptical element 25 aperture 43 and light source 18 are coordinated withreceive optics 40 so that a best focus emit optical module-to-targetdistance (at which an optimally focused image of aperture 43 isprojected on a target) is greater than a receive optic module-to-targetdistance (at which an optimally focused image of a target indicia, e.g.a bar code is incident on image sensor 32). Such an embodiment is highlyuseful in a 1D embodiment as shown by module 10-22, wherein an aimingpattern may serve as an illumination pattern. Configuring module 10-22to have an emit optical best focus distance greater than a receiveoptical best focus distance has been observed to improve a depth offield of module 10-22. At reader distances about the best receive opticfocus distance, module 10-22 because of high image quality can besuccessfully employed to read bar codes with a less than optimallyfocused aiming and pattern being imaged onto a target, T. At longerdistances that are about the distance of the best emit-optical focusdistance the optimally focused illumination pattern yields a high signalto noise ratio, and module 10-22 can successfully decode indicia at thelonger distance. In one example of module 10-22, module 10-22 isestablished to have a best emit optical focus distance (at whichaperture 43 is optimally focused on a target) of greater than about 7inches and best focus receive optical focus distance (at which anindicia is optimally focused onto sensor 32) of less than about 5inches.

In the embodiment of FIG. 6 u optical plate 26 includes imaging optics29′ on a light entry surface thereof for restricting a width of aimingpattern line segment 648. It may also be desirable to include diffusers27 on plate 26 in the optical path of light emitted by aiming lightsources 18 for the purpose of homogenizing aiming light. It may bedesirable, for example, to homogenize light emitted from aiming lightsources 18 in a horizontal plane. FIGS. 6 v, 6 w, and 6 x show cutawaytop views of various optical plates 26 taken along a row of aiming lightsources 18. Optical plates 26 shown in FIGS. 6 v, 6 w, and 6 x mayrepresent optical plates of e.g. module 10-1, module 10-9, or module10-22. In the example of FIG. 6 v optical plate 26 includes diffractiveoptic diffusers 27 a for homogenizing aimer pattern light in ahorizontal plane. In the example of FIG. 6 w, optical plate 26 includesrefractive optic vertically oriented cylindrical microlens diffusers 27b for homogenizing aiming light in a horizontal plane. In the example ofFIG. 6 x, optical plate includes vertically oriented cylindricalnegative lenses 27 c for homogenizing light in a horizontal plane.

While aiming optics 25 have been described herein as being positioned ona light exit surface of optical plate 26 and aiming diffusers 27 havebeen described as being formed on light entry surfaces of optical plate26, aiming optics 25 could be formed on a light entry surface and anyone of aiming diffusers 27 a, 27 b, and 27 c could be formed on a lightexit surface of optical plate 26. Furthermore, more than one aimingsystem optical element could be formed on a single surface. A verticallyoriented cylindrical microlens diffuser 27 b could be integrated into acylindrical lens 25 c of a plate light exit surface for example.

A description of how, in one embodiment, an aiming pattern generationsystem comprising an aiming light source 18, an aperture 43, and optics25 (e.g. a cylindrical or spherical lens) can generate a sharp, crispaiming line at a wide range of module-to-target distances(reader-to-target distances when module 10 is integrated in a reader) isprovided with reference to FIG. 6 y. In the imaging module side view ofFIG. 6 y, imaging lens 25 having focal point 668 projects an optimallyfocused image of aperture 43 at image plane 669. Light rays 670, 671,672, and 673 are light rays drawn to indicate the location of imageplane 669 and the size of the aperture image at image plane 669. Lightrays 674, 675, 676, and 677 are limit rays for the system of FIG. 6 y,as are defined by an aperture stop function provided by lens 25. It isseen that at reading distance 678, an optimally focused image ofaperture 43, and therefore a crisp, sharp aiming pattern e.g. aimingpattern 630 is projected on target T. At near reading distances e.g.distance 679, a less than optimally focused image of aperture 43 isimaged onto target T. Nevertheless, the projected image is crisply andsharply defined because substantially no light emanating from aperture43 can reach locations beyond the boundaries delimited by limit rays 674and 675. At far reading distances e.g. distance 680 a less thanoptimally focused image of aperture 43 is also imaged onto target T.Nevertheless, the far field projected image of aperture 43 is sharplyand crisply defined since substantially no light emanating from aperture43 can reach positions outside of the boundary defined by limit rays 676and 677. It can be seen from observation that a height dimension ofaiming pattern e.g. 630 can be controlled by controlling the heightdimension of lens 25. A thinner aiming line can be produced bydecreasing the height dimension of lens 25. Further, the crispness andsharpness of an aiming pattern e.g. aiming pattern 630 can be improvedby providing a sharply defined opaque aperture stop member or membersabout the borders of lens 25. Opaque aperture stop members 681 as shownin FIG. 2 n (module 10-9) and in FIG. 6 m (module 10-22) and FIG. 1 m(module 10-1) can be provided by a sharp edged mechanical memberattached, adhered or otherwise affixed to lens 25 or else may comprise amaterial which is sprayed on, painted on, or other deposited on asurface of lens 25.

Another aiming system which results in a crisp, sharply defined aimingpattern being projected over a wide range of module-to-target distancesis described with reference to Example 1. In Example 1, an apertureaiming system is provided having a very small aperture height of lessthan 1.0 mm. A size of aperture 43 can readily be reduced in a 2Dimaging module embodiment having separate illumination light sourceswithout compromising image capturing performance in that aimingillumination does not need to be utilized in the generation of imagedata as it is in many 1D imaging modules. The aiming system described inExample 1 is well suited for incorporation into e.g. module 10-1 shownin FIG. 1 a.

Example 1

An aiming pattern generation system 685 comprising a pair of aiming LEDs18, a pair of apertures 43, and a pair of spherical lens 25 ssubstantially as shown in FIG. 1 h is designed such that each half ofthe aiming pattern generating system has the properties as presented inTable 1.

TABLE 1 Aperture size: 1.85 mm (W) .times. 0.3 mm (H) LED (18): AgilentSubminiature HLMP QM00 (690 mcd) PCB (14a) to aperture 1.07 mm (entrysurface) distance: Aperture to lens member  4.1 mm light entry surfacedistance: Lens thickness:  1.7 mm Back focal length: 5.16 mm Front focallength: 5.16 mm Lens (25s) radius of curvature: r2 = −3 mm Lensmaterial: Polycarbonate Paraxial magnification: −1.028

Aiming system 685 generates aiming pattern light rays substantially asis illustrated in the computer modeled side view of system 685 of FIG. 6z. It is seen that the small size of aperture 43 substantially preventslight rays from reaching borders 686 of lens 25 s in the vertical plane(aiming light rays may reach borders 686 in the horizontal plane, thusthe lens aperture effect described with reference to FIG. 6 y may applyin the horizontal plane). Instead the bundle of light rays emanatingfrom aperture 43 are substantially concentrated so that they areincident on the lens member including lens surface 25 s toward a center(axis) of the lens member in the vertical plane. Although an imagingplane for the system described (at which an image of the aperture isoptimally focused onto a target T) was determined empirically to bedefined substantially on the order of millimeters from lens 25 s, anaiming pattern imaged onto a target T far distances substantially awayfrom the distance of optimal focus (such as beyond 7 inches) wasnevertheless observed to be sharp and crisp and substantially narrowalthough substantially thicker than at shorter reading distances. Lightrays exiting lens 25 s were observed to gradually diverge in thevertical plane (on the order of about 2 degrees) at distances beyondempirically estimated image plane 688. Accordingly, because of thegradual divergence of light rays exiting lens 25 s, a height dimension(thickness) of the pattern imaged onto a target remained substantiallynarrow and within the field of view of image sensor 32 at longermodule-to-target distances away from the distance of optimal focus, andwas observed to be crisply defined, corresponding to the shape ofaperture 43 at longer distances (over 7 in.). The gradual divergence oflight rays was believed to be the result of light entry light rays beingsubstantially concentrated toward a center (axis) of the lens memberincluding lens 25, and possibly, diffractive optic propertiesattributable to the small height dimension of aperture 43.

In Table 2, characteristics of an aiming pattern generated by system 685at various module to target distances are summarized.

TABLE 2 Module to Height Width Target Height Width Angle Angle Distance(mm) (mm) (deg.) (deg.) Field of View 2″ (50.8 3 mm 30 mm 1.69 16.4 37mm × 28 mm mm) 4″ (101.6 6 mm 44 mm 1.69 12.2 64 mm × 48 mm mm) 6″(152.4 9.5 mm   59 mm 1.79 10.9 95 mm × 71 mm mm) 8″ (203.2 13 mm  72 mm1.83 10.0 120 mm × 90 mm  mm)

The projected aiming pattern at various distances characterized in table2 are illustrated as shown in FIGS. 7 a-7 d. The shape of the aimingpattern was observed to be a sharply defined rectangle. The projectedaiming pattern, at the various distances exhibited a sharpnesssubstantially as depicted in FIGS. 7 a through 7 d. Importantly, aimingpattern 631 projected by system 685 exhibits sharply defined lateraledges 632. Further, sharply defined lateral edges 632 of pattern 631 arealways, in the system described at the distances considered projectedwithin a field of view of image sensor 32 as delimited by T and aspresented in Table 2. Aiming pattern 631 is preferably projected so thatsharply projected edges 632 are projected just within (as shown), on, orjust outside of a field of view of image sensor corresponding to atarget area, T. Configuring system 685 to project an aiming pattern 631having sharp lateral edges 632 proximate a lateral boundary of a fieldof view results in an aiming pattern that is useful in aiding thelateral centering of a field of view of module 10 on a target indicia.The selection of spherical lens 25 s which operates to image light raysin both a horizontal and vertical planes, results in sharp lateral edges632 of aiming pattern 631 being defined. Aiming system 685 may be usedin combination with a receive optical system having a best receive focusdistance of about 7 inches incorporated in an imaging module configuredin read common types of decodable dataforms in a reading range of fromless than about 1 inch to greater than about 15 inches.

D. Illumination Device Architectures

Referring again to module 10-2 shown in FIG. 2 a module 10-2 includessurface integrated illumination LEDs 16 and surface integrated targetLEDs 18. Surface integrated LEDs are LEDs of a type having a die placeddirectly on a printed circuit board. In the embodiment of module 10-2printed circuit board 14 b carries four illumination LEDs 16 and a pairof aiming LEDs 18. Referring to FIGS. 8 a-8 b illumination LED dies 16 dworking in combination with illumination optics 16 p flood a target areawith substantially uniform illumination. Target LED dies 18 d togetherwith targeting optics, 43 and 18 p project an aiming pattern into atarget area, T. As explained in copending U.S. patent application Ser.No. 09/802,579 (now U.S. Pat. No. 6,601,768) filed Mar. 8, 2001 entitled“Imaging Module for Optical Reader Comprising Refractive Diffuser”incorporated by reference, the aiming pattern projected by target LEDsand their associated optics may comprise, for example, a straight line,a split line, or a geometric shape.

Further details of surface integrated LEDs are described with referenceto cross sectional diagram of FIG. 8 a and the exploded top view of FIG.8 b. Referring to the cross sectional view of FIG. 8 a surfaceintegrated LEDs 16 and 18 are integrated in a printed circuit boardassembly comprising a printed circuit board substrate 14 s, an epoxylayer 14 e, and lenses 16 p and 18 p disposed over epoxy layer 14 e inopposing relation relative to LED dies 16 d and 18 d, respectively. Itis known that an epoxy layer 14 e of a surface integrated LED issemitransparent. Surface integrated LED circuit board 14 s is secondcircuit board 14 b of module 10-2 and first circuit board 14 a of module10-3. Dies 16 d and 18 d have associated therewith wire bonds 16 w and18 w which allow electrical current to be circulated through dies 16 dand 18 d. Accordingly, in the embodiment shown, illumination LEDs 16have a single or multiple LED die 16 d per LED and aiming LEDs 18include a single LED die 18 d per LED. LED dies 16 d, 18 d are disposedin reflector cups 14 r formed in surface of PCB substrate 14 s.Reflector cups 14 r may be manufactured by machining away the cupsection 14 r from PCB 14 a. Surface 14 c of each reflector cup 14 r iscoated with a reflective material such as gold, silver, aluminum, etc.

After LED dies are deposited in reflector cups 14 r, an epoxy layer 14 eis layered over PCB substrate 14 s. Lenses 16 p and 18 p aresimultaneously formed over epoxy layer 14 e in opposing relationrelative to cups 14 r. In the embodiment shown, illumination LED lens 16p preferably includes diverging optics (and therefore is also labeledelement 27) for diverging light rays from illumination LED dies 16 dinto a target space in a substantially uniform pattern. Lens 18 ppreferably includes converging optics for converging light rays fromlight emanating from LED die 18 d and therefore is also labeled element25. The edges 16 e and 18 e of lenses 16 p and 18 p are shown in FIG. 1f. In one embodiment a slit aperture as indicated by dashed line 43, maybe disposed in association with LED die 18 d and lens 18 p so that lens18 p images aperture 43 onto a target defined by a field of view ofimage sensor 32. Slit aperture 43 may be embedded in epoxy layer 14 e asindicated by dashed-in aperture slit 43 of FIG. 1 e or else slitaperture 43 may be formed above or below epoxy layer 14 e. Reflectorcups 14 r may have index matching epoxy disposed therein. The epoxy mayalso have titanium oxide added thereto as a dispersal material to aiddiffusion.

In module 10-1, as best seen in FIG. 1 h, aimer LEDs 18 and illuminationLEDs 16 are provided by side-leaded surface mounted back benched LEDs asare illustrated by the exploded side view as shown in FIG. 7 e.Side-leaded surface-mounted LEDs, like traditional leaded LEDs haveleads 18L extending therefrom but unlike traditional leaded LEDs theleads 18L extend from the sides of LED 16, 18. The side extending leads18L are sometimes referred to as “gull wings.” Side leaded surfacemounted LEDs further have substantially planar back surfaces 18 pb asdepicted in FIG. 7 e. Back surface 18 pb can be manufactured to besubstantially planar since back surface 18 b is devoid ofbottom-extending leads as in a traditional leaded LED. Planar, leadlessback surface 18 pb allows LEDs 18 to be readily back benched against PCB14 b or another planar member, thereby allowing LEDs 18 to be readilyinstalled at a precise orientation (in module 10-1, a normal angleorientation). Further, the mounting of side-leaded LEDs isuncomplicated, since there is no need, as in a traditional leaded LED tosolder the LED on a side of a printed circuit board opposite the side onwhich it is benched. Importantly, side leads 18L of a side-leadedsurface mount LED, unlike solder tabs of traditional surface mount LEDscan readily be soldered to a printed circuit board without altering aprecise right angle orientation of the LED as is controlled by the backbenching of the LED on circuit board. As shown in FIG. 1 h, side leadedillumination LEDs 16 mounted so that LEDs 18L are at angles relative toan X and Y axis. Mounting LEDs 16 at angles provides substantial spacingbetween LEDs 16L and post 84, which is typically conductive.

It will be appreciated that a precise angular orientation of LEDsrelative to the Z axis shown in FIG. 1 h is highly important in manyembodiments described herein. Precise angular orientation of LED 16,18relative to the Z axis is achieved by back benching of a side-leadedsurface mount LED against circuit board 14 a, 14 b. Tight back mountingof LEDs also reduced a Z direction space consumed by LEDs 16, 18.Further, use of side-leaded surface mount LEDs eliminates the need forextraneous alignment members or extraneous LED alignment steps in theassembly process.

One example of a side leaded surface mount LED which may be utilizedwith the invention is the HLMX “Subminiature High Performance AlInGaP”series LED manufactured by Agilent Technologies, Inc. of Palo Alto,Calif. Flat top HLMX-PXXX Agilent lamps have wide radiation patterns andtherefore are more useful, in certain applications when employed asillumination LEDs 16. Domed HLMX-QXXX Agilent lamps have more narrowradiation patterns and therefore, in certain applications are moreuseful when employed as aiming LEDs 18. In certain applications, bothaiming and illumination LEDs 16,18 are provided by domed HLMX QXXXlamps.

Variations of molded light pipe and LED assemblies described withreference to FIGS. 4 a-4 n are now described in greater detail withreference to FIGS. 8 c, 8 d, and 8 e. In the embodiment of FIG. 8 clight pipe and light source assembly 370 includes a single surface mountLED package 92-1 mounted to PCB 14 (e.g. 14 a, 14 b). LED 92-1 includesa single LED die. Further with reference to the embodiment of FIG. 8 clight pipe 311 is manufactured and mounted so that primary lightrefractive surface 376 of light pipe 311 forms a constant substantially45 degree angle with PCB 14.

In the embodiment of FIG. 8 d light pipe and light source assembly 371includes a multiple lead frame surface mount package 92-2. LED 92-2 hasthree LED dies LD mounted therein and a single Bragg reflector R.Disposing multiple LED dies LD in a LED package having a single Braggreflector R reduces the size of the surface mount LED package. Furtherwith reference to the embodiment of FIG. 8 d the light entry surface oflight pipe 311 are separated into three sections se.sub₁, se.su.₂, andse.su.₃, each corresponding to one of the LED dies LD. Each light entrysurface se.su.₁, se.su.₂, and se.su.₃ forms a different angle with PCB14 so as to optimize the efficiency of light transmission through lightpipe for each of the LED dies LD. A diffuser 27 can be molded ontodistal end of light pipe 311. Diffuser 27 diffuses light from light pipe311 and further reduces fresnel losses.

In the embodiment of FIG. 8 e light pipe and light source assembly 372includes a LED having three LED dies LD, each formed by mounting a lightemitting die on PCB 14 directly, and disposing epoxy_(e) over theassembly of PCB mounted dies. Direct mounting of LED dies LD onto PCB 14reduces the size of LED package 92-3. Further, referring to theembodiment of FIG. 8 e the primary light reflective surface s_(r) ofassembly 372 is divided into three sections sr.sub₁, sr.sub₂, andsr.sub₃ each corresponding to a different one of the LED dies LD. Eachsection sr.sub₁, sr.sub₂, and sr.sub₃ of light reflective curved surfaces_(r) forms a different angle with PCB 14 so as to optimize theefficiency of light transmission through light pipe 86-2 for each of theLED dies LD. For reducing fresnel losses in system 372, the index ofrefraction, N.sub_(e), of epoxy_(e) can be selected to substantiallymatch the index of refraction, N.su._(p), of molded light pipe 311.

Assembly 372 of FIG. 8 e and assembly 371 of FIG. 8 d illustrate twodifferent systems for optimizing the efficiency in light transmissionthrough a light pipe in a light pipe and source assembly having multipledies. LEDs 92-2 and LED 92-3 are single light sources which comprisemultiple dies. It will be understood that either of these systems can beemployed in a light pipe and light source assembly having multiple lightsources, wherein the multiple sources comprise standard surface mountLEDs having one Bragg reflector per die or standard single die leadedLEDs. Light rays LR depicted in FIGS. 8 c, 8 d, and 8 e are shown asoriginating from ideal light sources LD. It is understood that actuallight sources exhibit substantially greater variety in the origin andangles of the incident rays. It will be understood further that any ofthe LEDs, e.g. LED 16, LED 18 described herein can be provided by an LEDpackage having multiple LED dies incorporated therein. Infineon Corp. ofMunchen, Germany specializes in designing and manufacturing LEDscomprising multiple LED dies.

Apparatuses for increasing the efficiency of LEDs 16 and 18 aredescribed with reference to FIGS. 8 f and 8 g. In the system describedwith reference to FIG. 8 f, purchased part surface-mount LED 18, 18 s ismounted to PCB 14 (e.g. PCB 14 a, 14 b) and clear epoxy lens 18L ismolded over surface mount LED 18, 18 s. The lensing provided by lens 18Lreduces the amount of divergence of light emanating from the LED. In thesystem described with reference to FIG. 8 g, leaded LED 18 is mounted toPCB 14 (e.g. 14 a, 14 b) and a substantially box-shaped lens cap 18 c ismounted over LED 18. Lens cap 18C, like lens 18L reduces the amount ofwhich light emanating from LED 18 diverges. Reducing the divergence oflight rays emanating from an LED is particularly useful in the casewhere LEDS are aiming LEDs configured to be directed toward an aperture.However, some designers may place a premium on “filling” a completeaperture. The system comprising LED 18 s and lens 18L may be consideredgenerically as an LED 18. Likewise the system comprising LED 18 and lens18L in FIG. 7 m can be considered generically an LED 18.

E. Illumination/Aiming Color Emission Control and Coordination

It is seen that illumination light source 16 in the embodiment of FIG. 8b includes a plurality of LED dies 16 d. As shown in FIG. 8 hillumination light source 16 of module 10-23 which may be incorporatedin any one of reader housings 111 to define a reader 110 may be amultiple color emitting light source having multiple LED dies 16 d, eachbeing independently driveable, and each having an emission wavelengthband different from the remaining LED dies. Illumination light source16, 16MC shown in FIGS. 8 h and 1 z is a multiple color emitting lightsource having three LED dies 16 d-1, 16 d-2, and 16 d-3. Multiple colorLEDs 16 mc, 18 mc can be incorporated in any of the modules 10-1 to10-22 described herein. First LED die 16 d-1 is independently driveableto emit light in the blue light wavelength band; second LED die 16 d-2is independently driveable to emit light in the green light wavelengthband and LED die 16 d-3 is independently driveable to emit light theamber wavelength band. The set of signals presented by control circuit140 to LED 16MC may be termed a set of LED die driver signals. Controlcircuit 140 can be controlled to alter the current flow to LED 16MCbased on the present application of the reader 110. Multiple coloremitting light sources 16 and 16MC can be, for example, a model LATBcolor light source of the type available from Infineon TechnologiesCorporation of San Jose, Calif., USA.

Different surfaces often respond differently to different types ofillumination depending on their shape, color, and type of material.Control circuit 140 can be configured so that if decoding of a bar codefails using a first set of LED die driver signals, control circuit 140automatically presents a second set of LED die driver signals to LEDs 16and 16MC, and a third set of LED die driver signals to LEDs 16 and 16MCif a decoding fails a second time, and so on until decoding issuccessful. Control circuit 140 can be configured so that controlcircuit 140 saves the set of LED driver signals yielding a successfuldecode, and applies that set of driver signals to LED 16 and 16MC thenext time trigger 13 t is pulled to actuate decoding.

In another embodiment of the invention, reader 110 is configured so thatthe set of LED die driver signals presented by control circuit 140 toLEDs 16 mc is selectable by an operator so that the color emitted by LEDdies 16 d-1, 16 d-2, and 16 d-3 in combination is optimized for theapplication in which reader is presently being employed. For example, ifreader 110 is to be used to decode bar codes formed on a certainmetallic surface, an operator may configure reader 110 so that controlcircuit 140 presents to LED 16MC a set of LED driver signals that havepreviously been determined to be well-suited for use in capturing imagesformed the certain on metallic surfaces. An operator may also wish tochange the color emitted by LEDs depending on the colors present in atarget area comprising an indicia. For example, if a target areacomprises red indicia formed on a white background, an operator mayconfigure control circuit 140 e.g. via selection of a menu option sothat control circuit 140 presents a set of LED die driver signalsoperative to result in LEDs emitting white light, which will optimizecontrast in a captured frame of image data in the case comprises redindicia formed on white substrate.

Reader 110 can be configured so that selection of a particular one ormore control buttons of keyboard 13 k in response to display of certainindicia of display 14 d results in a certain set of LED die driversignals being presented by control circuit 140 to multiple coloremitting LED 16 and 16MC. Reader 110 can also be configured so thatreading of a certain type of “menu symbol” as will be described ingreater detail herein results in a certain set of LED die driver signalsbeing presented to multiple color emitting LED 16.

Reader 110 can also be configured so that the set of LED driver signalspresented to LED 16MC changes automatically in response to a sensedcondition sensed by reader 110, such as a sensed condition relating toambient light, the colors of indicia present in a target, the materialconditions of a target, the reader-to-target distance, the level offocus of an image, the shape or surface characteristic of a target, forexample. Reader 110 can automatically sense ambient light conditions byanalysis of a captured frame of image data without any reader drivenillumination. Reader 110 can determine reflectivity conditions of atarget by analysis of a captured frame of image data captured underknown illumination conditions. Various automatic range determination andfocus level detection methods are known by skilled artisans. As is wellknown, the reader-to-target distance of a reader can be detected byangularly directing a spot of light at a target from a reader housingand estimating the reader-to-target distance based on the position ofthe spot in a captured image. The degree of focus of an image can bedetected by several methods including the method described in commonlyassigned U.S. Pat. No. 5,773,810, issued Jun. 30, 1998 incorporatedherein by reference. Reader 110 can be configured so that the coloremitted by illumination LEDs 16MC and/or aiming LEDs 18MC changesdepending the reader-to-target distance or degree of focus of an image.For example, control circuit 140 may control LEDS 16MC to (and/or 18MC)automatically emit red light (indicating “TOO HOT” condition) if thereader-to-target distance is less than a desired minimumreader-to-target distance control circuit 140 may control LEDs 16MC(and/or 18MC) to automatically emit white light if the reader-to-targetdistance is within a range of acceptable distances, and may control LEDs16MC (and/or 18MC) to automatically emit blue light (indicating a “TOOCOLD” condition) if the reader-to-target distance is greater than adesired maximum reader-to-target distance. Similarly control circuit 140may control LEDs 16MC (and/or 18MC) to automatically emit, e.g. bluelight if the most recent captured image is exhibiting an unacceptabledegree of focus, and to control LEDs 16MC (and/or 18MC) to automaticallyemit, e.g. white light if a most recently captured image exhibits anacceptable degree of focus.

The presence or absence of a certain color present in a target area canreadily be detected for by employing in reader 10 a color image sensor,activating an appropriate color filter correlated with the color beingdetected for, and analyzing image signals generated by the color imagesensor. Advantages and benefits of utilization of a color image sensorin reader 110 are discussed more fully in U.S. patent application Ser.No. 09/904,697 (now U.S. Pat. No. 6,722,569) entitled “An Optical ReaderHaving a Color Imager” filed Jul. 13, 2001, incorporated herein in itsentirety by reference.

The variable emission color features described herein can be yielded byproviding different colored monochrome light sources rather thanmulticolor light sources. For example an illumination system cancomprise a bank of monochrome red LEDs and a bank of monochrome blueLEDs. Control circuit 140 can change to color of illumination of anillumination target from red to blue by deactivating the bank of redLEDs and activating the bank of monochrome blue LEDs.

Multiple color emitting LED dies also can be utilized as aimingillumination LEDs as is indicated by aiming LEDs 18MC shown in FIG. 1 r.Control circuit 140 can present different to multicolor aimer LEDillumination source 18MC different sets of LED driver signals dependingon the mode of operation of reader 110. For example, if reader 110 isoperating in a decoding attempt mode, control circuit 140 may present tomulticolor aimer LED 18MC a set of LED driver signals which result ingreen light being radiated from aimer LED 18MC. If reader 110successfully decodes a bar code, control circuit 140 may present a setof LED driver signals to multicolor LED 18MC which result in multicoloraimer LED 18MC radiating red light. That is, control circuit 140 maygenerate a good read indicator by causing the color of illuminationradiating from aimer illumination LEDs 18MC to change from a first colorto a second color when there has been a successful decode of a bar codeor character control circuit 140 can also indicate a successful read, oranother change in operating state by changing the set of LED driversignals that are presented to illumination LEDs 16MC when a bar code orcharacter has been successfully decoded.

The contrast between aiming illumination pattern 630 and backgroundillumination pattern 520 can be enhanced by selecting aiming lightsources 18 so that aiming light sources radiate light of a colordifferent than illumination light sources 16.

In one embodiment of the invention, illumination LEDs 16 of e.g. module10-1 comprise red light LEDs and aiming LEDs comprise green light LEDsor blue light LEDs. Selecting aiming LEDs to project light of a colordifferent than illumination LEDs results in an aiming pattern 74 beingprojected onto a target T in a color different than that of backgroundpattern 74 which enhances an operator's ability to perceive an aimingpattern relative to an illumination pattern. If aiming light sources 18and illumination sources 16 are selected to emit light at differentcolors the received light reflected from target can be filtered so thatlight from only one of the different colors is received by image sensor.FIG. 6 m shows a color filter 450 incorporated in an ID image module10-22. FIG. 3 g shows a color filter 450 incorporated in 2D imagingmodule 10-11. Color filter may be a band pass filter which passes lightof a wanted color or a blocking filter which blocks light of an unwantedcolor. With filter 450 in one application light from aiming lightsources 18 can be filtered (if different in color emission thanillumination sources 16), so that it is not necessary to “flicker”aiming light sources 18 or backout pattern 630 electronically.

The particular combination of colors forming an aiming pattern andillumination pattern can be selected based on the expected particularapplication of the optical reader in which the illumination and aimingillumination light sources are to be incorporated. In standard bar codereading application in which it is expected that the reader willencounter black-on-white printed indicia, illumination LEDs 18 can beselected to emit red light and aiming illumination LEDs can be selectedto emit blue light, for example, to form the contrasting illuminationpatterns indicated in FIG. 8 j. In an application where an opticalreader is expected to read fluorescent orange postnet codes,illumination LEDs 16 can be selected to emit green or blue light andaiming LEDs 18 can be selected to emit red light. In an applicationwherein an optical reader 10 is expected to be used to read red-on-whiteprinted indicia, illumination LEDs 16 can be selected to emit whitelight and aiming LEDs 18 can be selected to emit red, green, blue, oryellow light. In an application wherein optical reader 10 will be usedin a photo processing darkroom, illumination LEDs 16 can be selected toemit light in the infrared spectrum and aiming LEDs 18 can be selectedto emit red, green, blue, or yellow light.

Table 3 below summarizes the above described illumination lightsource-aiming light source and application correlations is presentedhereinbelow.

TABLE 3 Illumination Color Aimer Color Possible Applications Red Greenor Blue Standard bar code reading Green or Blue Red Different colorlight provides better contrast on certain bar code types such asfluorescent orange Postnet codes White Red, green, blue, or Standard barcode reading, yellow imaging of red indicia IR Red, green, blue, orSecure bar code applications, yellow photo processing darkroomapplications UV Red, green, blue, or Secure bar code applications yellow

Utilization of white illumination LEDs provides numerous advantages.White light is less distracting than is red light. Red lightillumination patterns have been observed to cause eye strain andheadaches. Furthermore, the color red indicates danger in many types ofindustrial applications. Thus, the use of white light avoids the problemof red illumination light being erroneously interpreted to indicate adanger condition by persons working in proximity with reader 10. Stillfurther, use of white light illumination light sources allowsred-printed indicia such as red ink signatures, red bar codes, and red“chops” as used in Asia to be imaged. Further, use of white lightillumination light sources provides good contrast between anillumination pattern and an aiming pattern when aiming illumination LEDsare selected to emit light in a narrow (non-white) band.

By utilizing multiple color emitting light source LEDs 16MC and/oraiming LEDs 18MC, different combinations of contrasting illumination andaiming patterns can be realized simply by presenting different sets ofLED die driver signals to aimer LEDs 18MC and illumination LEDs 16MCwithout physically removing and replacing the LEDS and withoutincreasing the size of module 10 as would be necessary if different LEDswere added to module 10. Reader 110 having multiple color emitting lightsource illumination and aiming LEDs 16MC and 18MC can be configured sothat a user can actuate control inputs to change the particular colorcombination defined by background pattern 72 and aimer pattern 74. Thecolor contrast combination between an illumination pattern and aimingpattern can also be made changeable by providing in reader 110, separatebanks of different-colored monochrome illumination light sources and/oraiming illumination light sources which may be selectively activateddepending upon the operating mode of reader 110. However, such asolution would significantly add to the size of module 10.

As indicated by reader 110 of FIG. 8 k control circuit 140 can beprogrammed to display on display 14 d a set of user selectableapplication settings, which are selectable by one of a well know menudriver selection methods as are explained in commonly assigned U.S.patent application Ser. No. 09/858,163 (published as U.S. PatentPublication No. 2002/0171745) entitled “Multimode Image Capturing andDecoding Optical Reader” filed May 15, 2001, incorporated herein byreference. In the embodiment shown in FIG. 8 k display 114 d displays toa user various application settings, namely “standard bar code,” “orangepostnet code,” “red indicia,” (“red bar code” in the specific example)and “secure bar code.” When one of the application menu optics isselected, control circuit 140 presents a set of LED die driver signalsto LEDs 16MC and 18MC corresponding to the menu selection in accordancewith the application-pattern correlations listed on Table 1. That is, ifthe standard bar code option is selected, control circuit 140 maypresent a set of LED die driver signals to LEDs 16MC and 18MC such thatillumination LEDs 16MC emit red light and aimer LEDs emit blue or greenlight. If the “red indicia” option 14 d-r is selected, control circuit140 may present a set of LED die driver signals to LEDs 16MC and 18MCsuch that illumination LEDs emit white light and imager LEDs emit redlight, and so on.

Reader 110 can also be configured so that the particular combination ofcolors projected by aiming LEDs 18MC and illumination LEDs 16MC changesautomatically in response to a sensed condition.

For example, reader 110 can be configured so that if reader 110 sensesthe presence of red indicia in a target area in a manner describedpreviously, control circuit 40 can present a set of LED driver signalsto LEDs 16MC and 18MC such that illumination LEDs 16MC emit white lightand aiming LEDs 18 c emit blue light, an illumination pattern colorcombination that is well-suited for imaging a target and comprising redindicia.

F. Receive Optics

When the size of module 10 is reduced, the sensitivity of module 10 tochanges in the distance of lens assembly 40 to image sensor 32. It istherefore advantageous to provide an arrangement between lens assembly40, shown as a lens barrel 40 and lens retainer 82 that allows barrel 40to be finely adjusted within retainer 82. An imaging lens incorporatedin a lens assembly 40 may be, for example, a single element lens, a twoelement lens (a lens doublet), a three element lens (a lens triplet), alens or lenses of assembly 40 may be made of various materials, e.g.glass, plastic.

In the prior art, lens barrels commonly comprised threads 40 t on theirouter surface which are received in threads 82 t of retainer 82 as shownin FIG. 11. The lens-to-image sensor distance in a threaded lens barrelsystem is adjusted simply by threading barrel lens assembly 40 intoretainer 82 until a desired lens-to-image sensor distance is achieved.

The precision with which the distance of a threaded lens barrel can beadjusted can be increased by changing the thread count of the barrel 40and the retainer 82. However, the cost of manufacturing barrel lensassembly 40 and retainer 82 increases substantially as the thread countof the system increases.

A low cost and finely adjustable barrel and lens holder system isdescribed primarily with reference to FIGS. 8L-8 r, while alternativeviews and/or embodiments of a lens assembly adjustment feature of theinvention are shown in FIGS. 1 h, 1 i, 1 o, 1 p, 1 s, and 2L. In theembodiment of FIG. 8L it is seen that both the interior surface of lensretainer 82 and exterior surface 410 of barrel 40 are threadless andsubstantially smooth. Barrel 40 is slidably received in retainer 82.Barrel 40 may slide on interior wall 412 of retainer 82 or else barrel40 may slide on rails of 435. Preferably, barrel 40 and retainer 82 aremanufactured to tight or extremely tight tolerances so that barrel 40does not move substantially axially within retainer 82. In furtheraspects of the barrel and retainer system of FIG. 8L, lens retainer 82comprises adhesive receipt aperture 414 and an elongated adjustment pinaperture 416 coextensive with the axis of retainer 82. Variations ofaperture 414 and aperture 416 are shown throughout the views. Referringto further aspects of barrel 40, lens barrel 40 includes notch 420 whichin the embodiment of FIG. 1 o is formed about the circumference ofbarrel 40. Lens retainer 82 may further include key 424 which engages acomplementarily formed key 426 of barrel 40 so that barrel 40 isreceived in a desired radial orientation in lens retainer 82.

For adjusting and securing barrel 82 b within retainer 82, module 10having barrel 82 b nonfixedly secured therein is disposed in a fixture93 which may be of a type shown in FIGS. 8 p and 8 q. Fixture 93 mayinclude one stationary member 93 s, one moveable member 93 m which ismoveable in small increments relative to stationary member 93 s, and aclamping device 93C which is actuatable for clamping module 10 withinfixture 93. When module 10 is disposed in fixture 93, pin 93 p offixture 93 passes through elongated pin receipt aperture 416 and engagesnotch of barrel 82 b. The lens-to image sensor distance is then finelyadjusted by adjusting the position of moveable member 93 m of fixture 93relative to the position of fixed member 93 s. In the fixture of FIGS. 8p and 8 q, micrometer adjustment knob 93 k is actuated to precisionadjust the position of member 93 m relative to member 93 s. To aid inthe adjustment of the lens-to-barrel distance, module 10 may be poweredup, positioned to image a test target T, and adapted to be incommunication with a display 168 d (FIG. 10 e) during the lens barreladjustment assembly step. An assembler may view an image of the testtarget displayed on display 168 d while adjusting the lens-to-imagesensor distance using fixture 93, and may determine whether a desireddistance is achieved based on the quality of the image displayed ondisplay 168 d. When a desired lens-to-image sensor distance is achieved,an operator disposes an adhesive in adhesive receipt aperture 414 sothat the adhesive bonds lens barrel 40 to retainer 82 in a fixedlysecure position. The adhesive may be e.g. a cyanocrylate based epoxyadhesive such as LOCTITE 401, LOCTITE UV 4304, LOCTITE 406, or LOCTITE4471 all available from LOCTITE Corporation of Rocky Hill, Conn. Thetest pattern which is imaged by module during the lens barrel adjustmentprocess may take on a variety of forms, but preferably comprises aplurality of fine print indicia so that the quality of focus can readilybe determined by observation of the displayed image. A dollar bill, forexample, may be utilized as a test target. The degree of focus can alsobe determined by image analysis of the image captured by processor 140described in connection with FIGS. 10 a-10 e. For example, adetermination of whether an acceptable degree of focus has been achievedcan be made based on the value of a degree of focus signal as describedin commonly assigned U.S. Pat. No. 5,773,810 incorporated herein byreference.

Referring to further aspects of a threadless barrel lens assemblyadjustment system, pin receiving notch 420 formed on barrel 40 of FIG. 8m is truncated as shown and does not extend circumferentially aboutbarrel 40. Further, adhesive receipt aperture 414 in the embodiment e.g.of FIG. 8L is formed at a location of retainer 82 defined by a flattenedplanar interior surface 424. Flattened planar interior surface 424 ofretainer 82 operates as a key and engages complementarily formedflattened planar surface 426 of barrel 40 to align barrel 40 in adesired radial orientation within retainer 82. Key surface 426 can alsobe concave as shown in FIG. 8 y, so that the retainer of adhesive bysurface 426 is improved so that a larger gap is defined between retainer82 and barrel 40. In addition to providing a keying function, thecomplimentary engaging surfaces 424 and 426 of barrel 40 and retainer 82operate to improve the security with which barrel 40 is held in placewithin retainer 82. The interface defined by planar surfaces 424 and 426operates to hold liquid adhesive in an isolated located during thecuring process, rather than allowing liquid adhesive to run anddissipate freely with retainer 82. The holding function is enhanced ifsurface 426 is concave. Because adhesive interface surface 426 of barrel40 and truncated notch 420 are spaced apart in the embodiment of FIGS.8L-8 m, adhesive material is not likely to invade notch 420 tocomplicate the adjustment process if further adjustment of barrel 40within retainer 82 is needed after application of adhesive material.Barrel 40 may be adjusted and secured within retainer 82 with use of afixture and a test image displaying display 168 d as describedpreviously in connection with FIGS. 8 p and 8 q. In another aspect offinely adjustable threadless lens assembly barrel system, adhesivematerial may be deposited into pin aperture 416 as well as aperture 414,to increase the holding force with which barrel 40 is held in retainer82. In such an embodiment, retainer 82 effectively comprises a pair ofadhesive receiving apertures 414, 416. As shown in FIGS. 8L and 8 o,retainer 82 may include a plurality of rails including rails 435. Barrelmay be adapted to ride on rails 435. Rails 435 may be aligned inparallel with an axis of barrel while interior walls 412 of retainer 82may be drafted at a small angle (e.g. 0.5 degrees) so that supportassembly 80 can more easily be removed from a mold. Support assembly 80according to the invention can comprise black polycarbonate. Rails 435of which retainer may have several (e.g. 4) simplify the process ofmaking support 80 and help define an adhesive accommodating gap betweenbarrel 40 and retainer 82.

In an alternative embodiment of a finely adjustable barrel and holdersystem, both lens barrel 40 b and retainer 82 comprise threads as areshown generally by the embodiment of FIG. 8 r. However, in a low costfinely adjustable threaded lens adjustment system, the threads of lensbarrel 82 b and retainer 82 are selected to be substantially coarse,loose tolerance threads such that barrel 40 is movable several micronsin the Z direction once it is received in retainer 82. An example of atype of course threads which are useful in finely adjustment barrel andholder system of the invention are Class 1 Coarse threads as designatedby the American National Standards Institute (ANSI). When substantiallycoarse threads are used in a finely adjustable threaded lens barrelsystem, barrel 40, in a rough adjustment step, is threaded into retainer82. In a fine adjustment step, barrel 40 is moved along the Z directionin lens retainer 82 without threading, taking advantage of the toleranceof the substantially coarse threads. A substantially coarsely threadedlens barrel, may have an adhesive receiving aperture 414 as shown ine.g. FIG. 8L. A finely adjustable coarse threaded lens barrel system mayalso include an elongated pin receipt aperture 416 as described inconnection with FIG. 8L and FIG. 2L which may also serve as an adhesivereceiving aperture. Furthermore, a barrel 82 b in a finely adjustablecoarse threaded system may have a threadless section comprising a notch410 as shown in FIG. 8 r for engagement by pin 93 p. Pin 93 p may alsoengage threads of barrel 82 b. When a desired lens to image sensordistance is achieved, adhesive may be applied to aperture 414, aperture416, or to another exposed interface between barrel 82 b and retainer 82to secure barrel 82 n in a fixed position on retainer 82. A threadedbarrel may be adjusted and secured within retainer 82 with use a fixtureand test image displaying display 168 d as described previously inconnection with FIGS. 8 p and 8 q.

In another embodiment of a finely adjustable barrel and retainer systemalso described with reference to FIG. 8 r, both barrel 40 and retainer82 comprise a threaded section 460, 462 and an unthreaded section 464,466. Preferably, unthreaded sections 464, 466, are manufactured toextremely tight tolerances to essentially prevent axial movement(movement of barrel relative to axis, a) of barrel 82 b within retainer82. Threaded sections 460, 462 may comprise e.g. loose tolerance, coursethreads such as ANSI class 1 threads, or tight tolerance fine threadssuch as ANSI class 3 threads. If threaded sections 460, 462 includecoarse threads, retainer 82 may include adhesive receipt and pin receiptapertures 414, 416 to enable fine adjustment. If threaded sections 464,466 include threads that are sufficiently fine, barrel 40 may be finelyadjusted within retainer 82 without use of pin 93 p and aperture 416. Itwill be seen that it is useful to provide adhesive aperture 414 whetheror not the adjustment system includes threads. Further, it is useful toprovide aperture 414 on any location on retainer 82 in a threaded systemirrespective the thread count and irrespective the span of threadsections 460, 462 on barrel 40 and retainer 82.

G. Packaging of Electronics

Referring now to further aspects of module 10, e.g. module 10-1, thesize of module 10 may be further reduced by mounting a partially orwholly “unpackaged” image sensor 32 onto first circuit board 14 a. Aprior art image sensor chip, or “image sensor” as referred to herein isshown in FIG. 8 z. Image sensor 32 includes a ceramic or plasticsubstrate 32 s, integrated lead frames 32L, and a protective cover 32 c.Integrated surface mount or lead frames 32L extend rigidly from themajor body of image sensor 32 and are adapted to be soldered or socketedto printed circuit board 14 a.

While the prior art image sensor is durable, and easy to install, italso consumes substantial space. As a space conserving measure, imagesensor 32 of module 10 is may be an image sensor without at least one ofthe following elements being integrated into the image sensor chip: (a)ceramic substrate, (b) protective cover, or (c) leads. Mounting an imagesensor 32 to printed circuit board 14 b that does not include one ormore of the above components reduces the space consumed by image sensor32.

Imaging module 10 (e.g. module 10-1) consumes space in the X, Y, and Zdimensions as defined by FIG. 1 a. It can be seen that mounting an imagesensor 32 that does not have an integrated substrate 32 s and/orprotective cover 32 c integrated therein substantially reduces theZ-direction space consumption requirements of image sensor 32 andtherefore, of module 10-1. Mounting an image sensor 32 that does nothave rigid lead frames 32L integrated therein substantially reduces theX and Y dimension requirements of image sensor 32 and therefore, ofmodule 10-1.

The inventors found that one or more of the above image sensor componentparts can be eliminated from the image sensor chip incorporated inmodule 10 without substantially affecting the durability and performanceof the module's imaging system. The image sensor integrated substrate 32s can be eliminated from an image sensor chip because image die 32 d ofchip 32 can be mounted directly on printed circuit board 14 a. Theprotective cover 32 c of image sensor 32 can be deleted because imagesensor 32, without an integrated cover 32 c can be adequately protectedby support assembly 80. Further, rigid lead frames 32L can be deletedfrom image sensor 32 because image sensor die 32 d can be directly wirebound to printed circuit board 14 a or soldered to printed circuit board14 a Methods for mounting a “substrateless” image sensor that does notinclude an integrated substrate 32 s to printed circuit board 14 a aredescribed with reference to FIGS. 8 s and 8 t. In the embodimentdepicted with reference to FIG. 8 s, image sensor die 32 d is depositeddirectly onto printed circuit board 14 a and wirebonded to printedcircuit board 14 a. Wirebonds 32 w can comprise for, example, Aluminum(AL) or Gold (AU). In the embodiment depicted with reference to FIG. 8 timage sensor die 32 d is structurally and electrically connected toprinted board 14 a via solder bumps 32 b interposed between die 32 d andprinted circuit board 14 b. Electronic packaging firms such as TaskMicroelectronics, Inc. of Montreal, Ontario specialize in mountingsubstrateless silicon based chips without lead frames directly ontoprinted circuit boards.

An alternative method for reducing the Z-direction space consumption ofmodule 10 in the area forward of printed circuit board 14 a is describedwith reference to FIG. 8 u. As seen in FIG. 8 u image sensor 32 can beface mounted to printed circuit board such that a periphery of face 32f, or top surface of image sensor 32 is benched onto a back side 14 a-rof circuit board 14 a provided that an image sensor window 14 w isformed in printed circuit board 14 a. Image sensor 32 in the embodimentof FIG. 8 u can be a typical “packaged” image sensor as is illustratedin FIG. 8 s having an integrated substrate, a protective cover, and leadframes or else image sensor 32 can be of a type that does not includeone or more elements selected from the group comprising an integratedsubstrate, protective cover or lead frame. Solder bumps 32 b mayelectronically and structurally secure image sensor 32 to PCB 14 a.

Miniature imaging modules as described herein will find increased use inbattery operated devices including cordless bar code readers, PDAs andcellular telephones. There is therefore, increased motivation for makingmodules as energy efficient as is possible so as to increase the batterylife of a battery which may be adapted to power module 10.

In the embodiment shown in FIG. 8 v an illumination circuit board 14 bof module 10-24 is adapted with a heat sink which draws heat away fromLEDs 16 and 18 so that LEDs 16 and 18 operate at improved efficiency. Across-section of an illumination circuit board is shown in FIG. 8 x. Atypical illumination circuit board of module 10-24, as shown in FIG. 8 vmay include seven layers, including three insulating fiberglass layers14 f 1, 14 f 2, and 14 f 3 interposed between conductive layers,typically comprising copper. As seen in FIG. 8 v illumination circuitboard 14 b may include one or more heat sink tabs 14T1 and 14T2extending therefrom. In the formation of a heat sink tab 14T1, one ormore of the copper layers may be extended outwardly from the edge e ofthe circuit board as is indicated by copper layer 14 c 2. A fiberglasslayer abutting extended layer 14 c 2 may also be extended from edge efor supporting the extended copper layer. Extended copper layer 14 c 2defining tab T1 may be electrically connected to a ground tracing ofprinted circuit board 14 b. Exposing a conductive copper surface of tabT1 to air removes heat from circuit board 14 a resulting in increasedefficiency and expected life in the operation of LEDs 16 and 18.Furthermore, one or more tabs 14T1 and 14T2 of module 10-24 can beattached to a heat sink structure 15 as is shown in FIG. 8 w. Heat sinkstructure 15 which is adapted to be situated in the housing of theimaging device in which module 10-24 is installed comprises a conductivematerial such as copper or aluminum. Heat sink structure 15 increasesthe surface area formed by the combination of tab 14T1 and structure 15and thereby increases the amount of heat that is removed from circuitboard 14 b. In another heat sinking apparatus a heat sink structure isconnected to a post or posts 84 as indicated in connection with FIG. 2h. Member 14 p attached to posts 84 can be a heat sink structurecomprised of a thermally conductive but electrically insulating materialsuch as Boralloy Pyrolytic Born Nitride from Advanced Ceramics Corp. ofCleveland, Ohio.

An important feature of the invention as embodied by module 10-9 is thatessentially all the illumination elements of a reader in which module10-9 is to be incorporated can be included on a single circuit boardshown as being provided by PCB 14 a. This is in contrast to the designof the prior art reader shown in FIG. 11 in which illumination elementsand image sensing elements are spread out over several circuit boards.In the prior art device shown in FIG. 11, an aiming illumination source53 is mounted to a first circuit board 54, illumination LEDs 55 aremounted to a second circuit board 56, while image sensor 32 is mountedto first circuit board 54. The device of FIG. 11 further includes athird circuit board 60 carrying signal processing and decodingelectrical hardware components. The assembly of a module of this priorart design is difficult and requires material components not required bythe design of the present invention including circuit boards 54 and 56and electrical connectors between the circuit boards such as connectors57 a and 57 b. Providing a single circuit board that carries an imagesensor, illumination LEDs, and aiming LEDs significantly simplifiesassembly, reduces material consumption and thereby reduces the overallcost of producing the module. Another important aspect of the inventionas embodied by module 10-9, in one embodiment, is that essentially allelectronic circuitry supporting the data processing operations requiredof module 10 are located on single, full function PCB 14 a, includingcircuitry for processing signals generated from image sensor 32,circuitry for capturing image data into a memory device, circuitry fordecoding and/or recognizing indicia represented in captured image data.Circuitry for supporting serial transfers of data to peripheral devicesmay also be carried by PCB 14 a.

The all in one PCB arrangement of the present invention is in contrastto the traditional design in the prior art wherein circuitry forprocessing signals from an image sensor, circuitry for capturing anddecoding image data and circuitry supporting serial interfacing withexternal devices are spread out over more than one circuit board.

In the design of the prior art reader shown in FIG. 11, a firstvertically oriented circuit board 56 is provided for carrying circuitryfor processing signals generated by an image sensor 32 and a secondhorizontally oriented circuit board 60, known as a “mother board” isprovided for carrying circuitry for storing image data and for decodingsymbologies. The one PCB design of the present invention providesnumerous advantages over the two PCB design of the prior art. Themultiple circuit board arrangement of the prior art requires a complexassembly procedure wherein the first circuit board 58 is mounted to afirst internal structure of the reader in which it is incorporated, thesecond circuit board is mounted to a second internal structure of thereader, and then the two circuit boards are electrically connected. Theseparate horizontal and vertical orientations of the two circuit boards58 and 60 is inefficient in terms of space consumption and imposesrestrictions on the configurations of housings in which the readeroptical and electrical components may be incorporated. The one fullfunction PCB design of the present invention does not exhibit thesedisadvantages.

In accordance with a feature of one embodiment of the inventiondescribed with reference to e.g. modules 10-1 through module 10-21,essentially all of the electrical signal processing components describedwith reference to FIG. 10 a may be carried by a single circuit board,circuit board 14 a, as is indicated by dashed-in border 14 a of FIGS. 10a-10 e. In order to incorporate essentially all of the electrical signalprocessing components of FIG. 10 a onto a single PCB 14 a, it isnormally necessary to integrate several electrical components into areduced number of electrical components. For example, using knownintegrated circuit fabrication techniques, components 142, 144, 146, and147 and interfaces 137, 137′, and 137″ can be incorporated in a singleintegrated circuit chip of reduced size. Further, as explained in anarticle by Eric R. Fossum entitled Digital Camera System on a Chip, IEEEComputer Society (IEEE Micro), Volume 18, Number 3, May/June 1998, imagesensor 132, signal processing components 135, 136, and components 142,144, 146, 147, 137, 137′, and 137″ may be incorporated in a singleintegrated circuit of reduced size.

H. Applications, Operating Environments, and Control CircuitFunctionality

FIGS. 9 a-k show examples of types of housings in which the modules ofthe present invention may be incorporated. FIGS. 9 a and 9 b show a 1Doptical reader 110-1, while FIGS. 9 c-9 h show 2D optical readers 110-2,110-3, and 110-4. Readers 110-1, 110-2, 110-3 comprise the form factorof a gun-styled reader while reader 110-4 compresses the form factor ofwhat is often referred to portable data terminal (PDT). Referring toadditional readers, reader 110-5 of FIG. 9 j comprises the form factorof a mobile telephone, reader 110-6 of FIG. 9 j comprises the form of aportable data assistant (PDA) while reader 110-7 of FIG. 9 k comprisesthe form factor of a finger-worn reader, sometimes referred to as a“ring scanner.” Housing 111 of each of the optical readers 110-1 to110-7 is adapted to be graspable by a human hand (or worn on a finger)and has incorporated therein at least one trigger switch 113 t foractivating image capture and decoding and/or image capture and characterrecognition operations. Readers 110-1, 110-2, and 110-3 includehard-wired communication links 178 for communication with externaldevices such as other data collection devices or a host processor, whilereaders 110-4 to 110-7 include an antenna 180 (seen in FIGS. 9 h and 9 ionly) for providing wireless communication with an external device suchas another data collection device or a host processor.

It will be seen that modules 10-1 to 10-8 in particular because of theirnotably small exemplary dimensions (0.810.times.0.450.times.0.560) orsubstantially smaller can be incorporated in virtually any smallinstrument housing, for example, a calculator, a pen, a medicalinstrument, and a watch in a addition to any of the housings describedin FIGS. 9 a-9L.

An embodiment of module 10-1 shown as incorporated an alternative mobilephone housing is shown in FIG. 9 m. In FIG. 9 n, module 10-1 isincorporated into an integrated housing of a writing instrument providedby a pen. The pen reader 110-9 of FIG. 9 n includes a housing 111 havingincorporated therein module 10-1, a processor assembly 130 including acontrol circuit 140 as described in connection with FIG. 10 a, which isresponsive to actuation of redundant triggers 113 t disposed to beaccessible from an exterior of housing 111, an ink reservoir (not shown)and a head-unit (e.g. a ball point ink dispenser) including tip 960 fordispensing ink from the reservoir onto a sheet of paper. Housing headsection 111 h can be made detachably attachable with the remainder ofhousing 111 so that housing 111 is a two piece housing or else headsection 111 h can be integrated into the remainder of housing 111 sothat housing 111 is a one-piece housing. Combining imaging module 10-1configured by circuit 140 to have dataform-reading functionality andwriting functionality in a common housing 111 is highly useful in thatdata form readers and writing instruments are devices which are bothused extensively in data collection applications. A module 10 accordingto the invention an also be incorporated in, for example medicationdispensing equipment, patient monitors of all forms, access controlequipment, integrated recognition equipment to add feature recognition(such as facial, hand, or retinal). As well, such modules may findapplication in household appliances such as sewing machines, andmicrowaves where indicia can provide useful functionality to the user.

Module e.g. 10-1 can be mounted to an internal member of a housing 111or another rigid member by screwing set screws through the housingmember and through screw holes 810 of module 10-1 described inconnection with FIG. 1 h and 1 i. Further, brass threaded inserts can bedisposed in holes 810 so that holes receive machine screws. In addition,module 10-1 includes connector 930 for receiving a flex connector toprovide electrical communication with circuitry of reader 110 e.g. a“mother board” 60 as in the prior art reader FIG. 11. Still further,support posts 84 can be utilized to mount, stabilize, or support module10-1 within a reader housing. As discussed previously module includingposts 84 can have post ends 84 e that protrude extensively from circuitboard 14 a. These post ends 84 e can be plugged into sockets 910 formedon a rigid member of members of an interior of a reader housing 111 oron another rigid member outside of a housing to mount, stabilize orsupport module e.g. 10-1. Additional posts 84 a, as shown in FIG. 2 kcan be interposed between sockets 910 and posts 84. A socket containingrigid member 916 may be provided by a housing wall as is indicated bythe embodiment of FIG. 9 o.

In addition to the above elements, readers 110-3, 110-4, 110-5 and110-6, each include a display 182 for displaying information to a userand a keyboard 184 for enabling a user to input commands and data intothe reader.

Any one of the readers described with reference to FIGS. 9 a-9 k may bemounted in a stationary position as is illustrated in FIG. 9L showing ageneric optical reader 110 docked in a scan stand 190. Scan stand 190adapts portable optical reader 110 for presentation mode scanning. In apresentation mode, reader 110 is held in a stationary position and anindicia bearing article is moved across the field of view of reader 110.Of course, only module 10 described herein can be placed in a scan stand190 or may otherwise be mounted (replaceably or fixedly) in a stationaryposition.

Block diagrams of electrical circuit control configurations which may bewholly or partially incorporated in module 10 or used in combinationwith circuitry of module 10 are now described.

Referring to the block diagram of FIG. 10 a, imaging device processorassembly 130 includes an illumination assembly 121 for illuminating atarget area T, such as a substrate bearing a 1D or 2D bar code symbol ora text string, and an imaging assembly 133 for receiving an image ofobject T and generating an electrical output signal indicative of thedata optically encoded therein. Illumination assembly 121 may, forexample, include an illumination source assembly e.g. 16, 18, togetherwith an illuminating optics assembly 124, such as one or more lenses 25,diffusers 27, wedges 28, reflectors 640 or a combination of suchelements, for directing light from light source 16, 18 in the directionof a target object T. Illumination assembly 121 may comprise, forexample, laser or light emitting diodes (LEDs) such as white LEDs or redLEDs. Illumination assembly 121 may include target illumination opticsfor projecting an aiming pattern e.g. 630, 631, 647 on target T.Illumination assembly 121 may be eliminated if ambient light levels arecertain to be high enough to allow high quality images of object T to betaken. Illumination assembly 121 may also be located remote from imagingdevice housing 111, at a location so as to eliminate or reduce specularreflections. Imaging assembly 133 may include an image sensor 32, suchas a color or monochrome 1D or 2D CCD, CMOS, NMOS, PMOS, CID or CMDsolid state image sensor, together with an imaging optics assembly 40for receiving and focusing an image of object T onto image sensor 32.Features and advantages associated with incorporating a color imagesensor in an imaging device, and other control features which may beincorporated in control circuit 140 are discussed in greater detail inU.S. patent application Ser. No. 09/904,697, (now U.S. Pat. No.6,722,569) filed Jul. 13, 2001, entitled “An Optical Reader Having aColor Imager” incorporated herein by reference. The array-based imagingassembly shown in FIG. 10 a may be replaced by a laser array basedimaging assembly comprising one or more laser sources, a scanningmechanism, emit and receive optics, at least one photodetector andaccompanying signal processing circuitry.

Imaging device processor assembly 140 of the embodiment of FIG. 10 aincludes programmable control circuit 140 which preferably comprises anintegrated circuit microprocessor 142 and field programmable gate array(FPGA 144). The function of FPGA 144 could also be provided byapplication specific integrated circuit (ASIC), which is also consideredto be designated by reference character 144 in FIGS. 10 a-10 e. ICmicroprocessor 142 can be e.g. a Motorola Power PC, 82E ICMicroprocessor as an INTEL, Strong Arm, SA1110. FPGA 144 may be e.g. aXilinx, SPARTAN, XCSXXXX FPGA IC.

Processor 142 and FPGA 144 are both programmable control devices whichare able to receive, output and process data in accordance with a storedprogram stored in memory unit 145 which may comprise such memoryelements as a volatile or non-volatile read/write random access memoryor RAM 146, 146-1 and an erasable read only memory or EROM 147, 147-1.Memory 145 may also include one or more long term non-volatile memorystorage devices (148, 145). For example, storage device 148, 145 mayinclude e.g. a hard drive, or floppy disk to which data can be writtento or read from. Storage device 148, 145 can be of a type that issecurely installed in housing 111 (e.g. a hard drive) or can be of atype that can be removed from housing 111 and transported (e.g. floppydisk). Memory 145 can include what is referred to as a “flash” memorydevice. Several standardized formats are available for such flash memorydevices including: “Multimedia” (MMC), “Smart Media,” “Compact Flash,”and “Memory Stick.” Although the transfers of data between processor 140and a flash memory device normally involve “blocks” of data and not“bytes” of data as in standardly known non-volatile RAM device, theoperation of a “flash” memory device is similar to a standardly knownnon-volatile RAM memory device. Accordingly, a flash memory device canbe considered to be represented by the one or more RAM blocks 146 ofFIGS. 10 a-10 e. As is well known, flash memory devices are commonlyavailable in a form that allows them to be removed from a first deviceand transported to a second device, e.g. between device 110 and device168. Flash memory devices are particularly well suited for storing andarchiving image data.

Processor 142 and FPGA 144 are also both connected to a common bus 149-1through which program data and working data, including address data, maybe received and transmitted in either direction to any circuitry that isalso connected thereto. Processor 142 and FPGA 144 differ from oneanother, however, in how they are made and how they are used.

More particularly, processor 142 is preferably a general purpose,off-the-shelf VLSI integrated circuit microprocessor which has overallcontrol of the circuitry of FIG. 8 a, but which devotes most of its timeto decoding decodable image data such as symbology or text characterdata stored in RAM 146, 146-1 in accordance with program data stored inEROM 147, 147-1. FPGA 144, on the other hand, is preferably a specialpurpose VLSI integrated circuit, such as a programmable logic or gatearray, which is programmed to devote its time to functions other thandecoding image data, and thereby relieve processor 142 from the burdenof performing these functions.

The actual division of labor between processor 142 and FPGA 144 willnaturally depend on the type of off-the-shelf microprocessors that areavailable, the type of image sensor which is used, the rate at whichimage data is output by imaging assembly 133, etc. There is nothing inprinciple, however, that requires that any particular division of laborbe made between processors 142 and 144, or even that such a division bemade at all.

With processor architectures of the type shown in FIG. 10 a, a typicaldivision of labor between processor 142 and FPGA 144 will be as follows.Processor 142 is preferably devoted primarily to such tasks as decodingimage data in response to trigger 113 t being activated, once such datahas been stored in RAM 146, 146-1, controlling the outputting of userperceptible data via aural output 114A, good read indicator 114 g anddisplay 114 d and, recognizing characters represented in stored imagedata according to an optical character recognition (OCR) scheme inresponse to an actuation of trigger 113 t.

FPGA 144 is preferably devoted primarily to controlling the imageacquisition process, the A/D conversion process and the storage of imagedata, including the ability to access memories 146-1 and 147-1 via a DMAchannel. FPGA 144 may also perform many timing and communicationoperations. FPGA 144 may, for example, control the illumination of LEDs16,18, the timing of image sensor 132 and an analog-to-digital (A/D)converter 136-1, the transmission and reception of data to and from aprocessor system external to assembly 130, through an RS-232, a networksuch as an Ethernet, a serial bus such as USB, a wireless communicationlink (or other) compatible I/O interface as is indicated by interface137-2. FPGA 144 may also control the outputting of user perceptible datavia an output device, such as aural output device 114 a, a good read LED114 g and/or a display monitor which may be provided by a liquid crystaldisplay such as display 114 d. Control of output, display and I/Ofunctions may also be shared between processors 142 and 144, assuggested by bus driver I/O interface 137-3 or duplicated, as suggestedby microprocessor serial I/O interface 137-1 and interface 137-2. Asexplained earlier, the specifics of this division of labor is of nosignificance to the present invention. The imaging device described withreference to FIG. 10 a can be adapted for use in connection with theinvention by providing a display, e.g. display 168 d that is external tohand-held housing 111, but is in communication with control circuit 140.

FIG. 10 b shows a block diagram exemplary of an optical imaging devicewhich is adapted to easily receive user-input control instructionsresulting in a change in an operating program of an imaging device. Inaddition to having the elements of single state imaging device circuitof FIG. 10 a, imaging device 10 b includes a keyboard 113 k forinputting data including instructional data and a display 114 d fordisplaying text and/or graphical information to an operator. Keyboard113 k may be connected to bus 148-1, FPGA 144 or to processor 142 asindicated in FIG. 2 b. Display 114 d may be connected to FPGA 144, toprocessor 142 or to system bus 148-1 as is indicated in the particularembodiment of FIG. 10 b.

An operator operating optical imaging device 110 b can reprogram imagingdevice 110 b in a variety of different ways. In one method forreprogramming imaging device 110-b, an operator actuates a controlbutton of keyboard 113 k which has been pre-configured to result in thereprogramming of imaging device 110 b. In another method forreprogramming imaging device 110 b an operator actuates control of aprocessor system not integral with imaging device 110 b to transmit aninstruction to reprogram imaging device 110 b. According to anothermethod for reprogramming imaging device 110 b, an operator moves imagingdevice 110 b so that a “menu symbol” is in the field of view of imagesensor 32 and then activates trigger 113 t of imaging device 110 b tocapture an image representation of the menu symbol. A menu symbol is aspecially designed bar code symbol which, when read by an appropriatelyconfigured optical imaging device results in an imaging device beingprogrammed. The reprogramming of an optical imaging device with use of amenu symbol is described in detail in commonly assigned U.S. Pat. No.5,965,863 incorporated herein by reference. Because the second and thirdof the above methodologies do not require actuation of a imaging devicecontrol button of keyboard 113 k but nevertheless result in a imagingdevice being reprogrammed, it is seen that imaging device 110 may bekeyboardless but nevertheless reprogrammable. It will be seen that thesecond or third of the above methodologies can be adapted for selectingoperating modes described herein.

A typical software architecture for an application operating programtypically executed by an optical imaging device as shown in FIG. 10 b isshown in FIG. 10 f depicting a memory map of a program stored in programmemory 147-1. Application operating program 160 adapts an imaging devicefor a particular application. Three major applications or functions foran optical imaging device imaging device having image capture capabilityare: (1) comprehensive decoding; (2) data transfer; and (3) imagecapture, e.g. signature capture. In a comprehensive decodingapplication, imaging device 110 may preliminarily analyze and thendecode a message corresponding to a bar code symbol or OCR decodabletext character. In a data transfer application, imaging device 110uploads character text files or image files to a processor systemlocated externally relative to imaging device housing 111. In asignature capture application, imaging device 110 may capture an imagecorresponding to a scene having a signature, parse out from the imagedata that image data corresponding to a signature, and transmit thecaptured signature data to another processing system. It is seen thatthe third of such applications can be carried out by an optical imagingdevice imaging device that is not an optical imaging device decoderequipped with decoding capability. Numerous other application operatingprograms are, of course possible, including a specialized 1D decodingapplication, a specialized 2D bar code decoding algorithm, a specializedOCR decoding application which operates to decode OCR decodable textcharacters, but not bar code symbols.

Referring now to specific aspects of the software architecture of anoperating program 160, program 160 includes an instruction section 162,and a parameter section 164. Further, instruction section 162 mayinclude selectable routine section 162 s. Instructions of instructionsection 162 control the overall flow of operations of imaging device110. Some instructions of instruction section 162 reference a parameterfrom a parameter table of parameter section 164. An instruction ofinstruction section 62 may state in pseudocode, for example, “setillumination to level determined by [value in parameter row x].” Whenexecuting such an instruction of instruction section 162, controlcircuit 140 may read the value of parameter row 164 x. An instruction ofinstruction section 162 may also cause to be executed a selectableroutine, that is selected depending on the status of a parameter valueof parameter section 164. For example, if the application program is abar code decoding algorithm then an instruction of instruction section162 may state in pseudocode, for example, “launch Maxicode decoding ifMaxicode parameter of parameter row 164 y is set to “on.” When executingsuch an instruction, control circuit 140 polls the contents of row 164 yof parameter section 164 to determine whether to execute the routinecalled for by the instruction. If the parameter value indicates that theselectable routine is activated, control circuit 140, executes theappropriate instructions of routine instruction section 162 s to executethe instruction routine.

It is seen, therefore, that the above described software architecturefacilitates simplified reprogramming of imaging device 110. Imagingdevice 110 can be reprogrammed simply by changing a parameter ofparameter section 164 of program 160, without changing the subroutineinstruction section 162 s or any other code of the instruction section162 simply by changing a parameter of parameter section 164. Theparameter of a parameter value of section 162 can be changed byappropriate user control entered via keyboard 113 k, by reading a menusymbol configured to result in a change in parameter section 164, or bydownloading a new parameter value or table via a processor system otherthan system 140 as shown in FIGS. 10 a and 10 b. The reprogramming ofimaging device 110 b can of course also be accomplished by downloadingan entire operating program including sections 162 and 164 from aprocessor system other than a system as shown in FIGS. 10 a and 10 b.

Another architecture typical of an optical imaging device which may beconfigured in accordance with the invention is shown in FIG. 10 c.Imaging device 110 c comprises a control circuit 140 having a processorsystem 140 s 1, and an integrated host processor system 140 s 2 whichincludes host processor 140 hp and an associated memory 145-2. “Hostprocessor system” herein shall refer to any processor system whichstores a imaging device application operating program for transmissioninto a processor system controlling operation of a imaging deviceimaging system 133 or which exercises supervisory control over aprocessor system controlling operation of a imaging device imagingsystem 133, or which stores in its associated memory more than oneapplication operating program that is immediately executable onreception of a command of a user. In a imaging device having twoprocessors such as processor 142 and processor 140 hp, processor 142 istypically dedicated to processing image data to decode decodableindicia, whereas processor 140 hp is devoted to instructing processor142 to execute decoding operations, receiving inputs from trigger 113 tand keyboard 113 k, coordinating display and other types of output byoutput devices 114 d, 114 g, and 114 a and controlling transmissions ofdata between various processor systems.

In architectures shown in FIG. 10 c having dedicated decoding processorsystem 140 s 1 and a powerful, supervisory host processor system 140 s2, host processor system 140 s 2 commonly has stored thereon anoperating system, such as DOS WINDOWS or WINDOWS, or an operating systemspecially tailored for portable devices such as, WINDOWS CE availablefrom Microsoft, Inc. In the case that host processor system 140 s 2includes an operating system such as DOS or WINDOWS CE, the instructionsection and parameter section of the operating program controlling theoperation of host processor system 140 s 2 normally are programmed in ahigh level programming language and assembled by an assembler beforebeing stored in memory 147-2 and therefore may not reside in consecutiveaddress locations as suggested by program 160 shown in FIG. 10 f.Nevertheless, host processor system 140 s 2 having an operating systemintegrated thereon can readily assemble an operating program into such aform for loading into an external processor system that does not have anoperating system stored thereon.

Referring to further aspects of imaging devices 110 a, 110 b, and 110 cat least one I/O interface e.g. interface 137-1, 137-2, and 137-3facilitates local “wired” digital communication such as RS-232,Ethernet, serial bus including Universal Serial Bus (USB), or localwireless communication technology including “Blue Tooth” communicationtechnology. At least one I/O interface, e.g. interface 137-3, meanwhile,facilitates digital communication with remote processor assembly 188-1in one of an available remote communication technologies includingdial-up, ISDN, DSL, cellular or other RF, and cable. Remote processorassembly 88-1 may be part of a network 188N of processor systems assuggested by assemblies 188-2, 188-3, and 188-4 links 188L and hub 188He.g. a personal computer or main frame computer connected to a network,or a computer that is in communication with imaging device 10 c only andis not part of a network. The network 88N to which assembly 188-1belongs may be part of the internet. Further, assembly 188-1 may be aserver of the network and may incorporate web pages for viewing by theremaining processor assemblies of the network. In addition to being incommunication with imaging device 110 c, assembly 188-1 may be incommunication with a plurality of additional imaging devices 110′ and110″. Imaging device 110 c may be part of a local area network (LAN).Imaging device 110 may communicate with system 188-1 via an I/Ointerface associated with system 188-1 or via an I/O interface 1881 ofnetwork 188N such as a bridge or router. Further, a processor systemexternal to processor system 140 such as processor system 170 s may beincluded in the communication link between imaging device 110 andassembly 188-1. While the components of imaging devices 110 a, 110 b,and 110 c are represented in FIGS. 10 a-10 c as discreet elements it isunderstood that integration technologies have made it possible to formnumerous circuit components on a single integrated circuit chip. Forexample, with present fabrication technologies, it is common to formcomponents such as components 142, 140, 146-1, 147-1, 137-2, and 137-1on a single piece of silicone.

Furthermore, the number of processors of imaging device 110 is normallyof no fundamental significance to the present invention. In fact ifprocessor 142 is made fast enough and powerful enough special purposeFPGA processor 144 can be eliminated. Likewise, referring to imagingdevice 110 c, a single fast and powerful processor can be provided tocarry out all of the functions contemplated by processors 140 hp, 142,and 144 as is indicated by the architecture of imaging device 110 e ofFIG. 10 e. Still further, it is understood that if imaging device 110includes multiple processors the processors may communicate via paralleldata transfers rather than via the serial communication protocolindicated by serial buses 149-1 and 149-2. In addition, there is norequirement of a one-to-one correspondence between processors andmemory. Processors 142 and 140 hp shown in FIG. 10 c could share thesame memory, e.g. memory 145-1. A single memory e.g. memory 45-1 mayservice multiple processors e.g. processor 142 and processor 140 hp.

Referring to the embodiment of FIG. 10 d, it is seen that it is notnecessary that the entirety of electrical components of an opticalimaging device 110 be incorporated in a portable device housing 111. Theelectrical components of imaging device 110 d are spread out over morethan one circuit board that are incorporated into separate devicehousings 111 and 171. It is understood that circuitry could be spreadout into additional housings. Control circuit 140 in the embodiment ofFIG. 10 d is incorporated entirely in the housing 171 that isnon-integral with portable device housing 111. Housing 171 is shown asbeing provided by a personal computer housing, but could also beprovided by another type of housing such as a cash register housing, atransaction terminal housing or a housing of another portable devicesuch as housing 111. At least one operating program for controllingimaging assembly 133 and for processing image signals generated fromimaging assembly 133 is stored in EROM 147-1 located within PC housing171. For facilitating processing of signals generated from imagingassembly 133 by a processor system that is not integrated into portablehousing 111 a high speed data communication link should be establishedbetween imaging assembly 133 and processor system 140. In the embodimentof FIG. 10 d, I/O interfaces 137-4 and 137-5 and communication link 139may be configured to operate according to the USB data communicationprotocol. The configuration shown in FIG. 10 d reduces the cost, weight,and size requirements of the portable components of imaging device 110d, which in imaging device 110-4 are the components housed withinportable housing 111. Because the configuration of FIG. 10 d results infewer components being incorporated in the portable section 111 ofimaging device 110 d that are susceptible to damage, the configurationenhances the durability of the portable section of imaging device 110-4delimited by housing 111.

The control circuit 140 as shown in the embodiment of FIG. 10 d can bein communication with more than one “shell” processorless imaging devicecomprising a imaging device housing and a imaging device circuitry shownby the circuitry within dashed housing border 111 of FIG. 10 d. In thecase that a control circuit as shown in FIG. 10 d services many “shell”imaging devices or processor-equipped imaging devices input/output port137-5 should be equipped with multiplexing functionality to service therequired data communications between several imaging devices and/orshell imaging devices and a single processor system.

The imaging device communication system of FIG. 10 e has a physicallayout identical to imaging device 10 d, but is optimized for adifferent operation. System 167 is a communication system in whichimaging device processor system 140 communicates with a nonintegratedlocal host processor assembly 168 provided by a personal computer 168having a PC housing 171, a processor system 170 s, a storage device 175(e.g. hard drive), a keyboard 168 k, a mouse 168 m, and a display 168 d.Provided that link 167L is a high speed communication link,nonintegrated local host processor system 170 s could be programmed toprovide functioning identical to processor system 140 s of imagingdevice 110 d. However, because imaging device 110 e comprises anintegrated processor system 140 such programming is normallyunnecessary, although as described in copending U.S. patent applicationSer. No. 09/385,597, incorporated by reference herein it is useful toconfigure processor system 140 communication with a host processorsystem e.g. 170 s so that certain components of imaging device 110 suchas trigger 113 t can be controlled remotely by host processor system 170s, which in one embodiment is nonintegrated. Accordingly, in imagingdevice-host communication systems as shown in FIG. 10 e nonintegratedhost processor assembly 168 typically is programmed to provide functionsseparate from those of the imaging device processor systems described inconnection with FIGS. 10 a-10 d.

As described in U.S. Pat. No. 5,965,863, incorporated herein byreference, one function typically provided by nonintegrated local hostprocessor system 70 s is to create operating programs for downloadinginto imaging device 110. Processor system 170 s typically has anoperating system incorporated therein, such as WINDOWS, which enables anoperator to develop operating programs using a graphical user interface,which may be operated with use of a pointer controller 168 m.Nonintegrated local processor system 170 s also can be configured toreceive messages and/or image data from more than one imaging device,possibly in a keyboard wedge configuration as described in U.S. Pat. No.6,161,760, incorporated herein by reference. It is also convenient toemploy processor system 170 for data processing. For example aspreadsheet program can be incorporated in system 170 s which is usefulfor analyzing data messages from imaging device 110 e. An imageprocessing application can be loaded into system 170 s which is usefulfor editing, storing, or viewing electronic images received from imagingdevice 110 e. It is also convenient to configure imaging device 110 e tocoordinate communication of data to and from a remote processor assemblysuch as assembly 188-1. Accordingly processor assembly 168 typicallyincludes I/O interface 174-2 which facilitates remote communication witha remote processor assembly, e.g. assembly 188-1 as shown in FIG. 10 c.

While the present invention has been described with reference to anumber of specific embodiments in order to set forth the best modethereof, it will be understood that the spirit and scope of the presentinvention should be determined with reference to the following claims.

1. A bar code decoding optical reader comprising: an imaging modulesupporting in combination a solid state image sensor, imaging optics forfocusing an image onto said solid state image sensor, and at least onelight source, wherein said optical reader has a field of view, andwherein said imaging module is adapted so that light from said at leastone light source is projected toward a target defined by said field ofview; and a housing having an enlarged head portion and a straightelongated body portion, the straight elongated body portion extendingfrom the head portion and having a shorter circumference than acircumference of said enlarged head portion, said optical reader furtherbeing configured so that said straight elongated body portion is adaptedto be held in a hand, said optical reader further being configured sothat said straight elongated body portion extends rearward from saidenlarged head portion in a line substantially directed toward saidtarget, wherein disposed at said enlarged head portion of said housingis a trigger for actuation of decoding operations, and wherein saidimaging module is disposed within said enlarged head portion, andfurther wherein said optical reader is configured to capture anelectronic representation of said target while said optical reader is ata distance spaced apart from said target.
 2. The optical reader of claim1, wherein said housing encapsulates circuitry for wirelessly sendingdata to a device external from said housing.
 3. The optical reader ofclaim 1, wherein said optical reader is configured so that said field ofview is a two dimensional field of view.
 4. The optical reader of claim1, wherein a section of said housing is configured to be detachablyattachable with a body external to said section.
 5. The optical readerof claim 4, wherein said section is disposed at an interface betweensaid enlarged head portion and said elongated body portion, and whereinsaid body external to said section is said elongated body portion ofsaid housing.
 6. The optical reader of claim 1, wherein said solid stateimage sensor is a 2D image sensor.
 7. A bar code decoding optical readercomprising: an imaging module of generally rectangular parallelepipedconfiguration supporting in combination a solid state image sensor,imaging optics for focusing an image onto said solid state image sensor,and at least one light source, wherein said optical reader has a fieldof view, and wherein said imaging module is adapted so that light fromsaid at least one light source is projected toward a target defined bysaid field of view; and a housing having an enlarged head portion and astraight elongated body portion, the straight elongated body portionextending from the head portion and having a shorter circumference thana circumference of said enlarged head portion, said optical readerfurther being configured so that said straight elongated body portion isadapted to be held in a hand, said optical reader further beingconfigured so that said straight elongated body portion extends rearwardfrom said enlarged head portion in direction substantially parallel withsides of said imaging module, wherein disposed at said enlarged headportion of said housing is a trigger for actuation of decodingoperations, and wherein said imaging module is disposed within saidenlarged head portion, and further wherein said optical reader isconfigured to capture an electronic representation of said target whilesaid optical reader is at a distance spaced apart from said target. 8.The optical reader of claim 7, wherein said housing encapsulatescircuitry for wirelessly sending data to a device external from saidhousing.
 9. The optical reader of claim 7, wherein said optical readeris configured so that said field of view is a two dimensional field ofview.
 10. The optical reader of claim 7, wherein a section of saidhousing is configured to be detachably attachable with a body externalto said section.
 11. The optical reader of claim 10, wherein saidsection is disposed at an interface between said enlarged head portionand said elongated body portion, and wherein said body external to saidsection is said elongated body portion of said housing.
 12. The opticalreader of claim 7, wherein said solid state image sensor is a 2D imagesensor.
 13. The bar code decoding optical reader of claim 7, whereinsaid imaging module includes conductive support posts.
 14. The bar codedecoding optical reader of claim 7, wherein said at least one lightsource comprises at least two light sources emitting light in differentwavelength emission bands.
 15. The bar code decoding optical reader ofclaim 7, wherein said at least one light source comprises anilluminating light source capable of emitting red light and an aiminglight source capable of emitting green light.